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Android BSP工程師
Job Description
1. Android platform bring-up and SW integration, optimize, and debug.
2. Component Driver integration and porting (e.q Sensors, Display, Touch, Audio, Charger, BT, WiFi, LTE, Camera…)
3. Factory Test Mode design and integration.
4. Performance Tuning (e.q Thermal Mechanism, Power Consumption, Stability.)
5. Factory test script design and failure analysis.
Requirements
1. 3+ years of experience working on Android or Linux embedded devices.
2. Experience in Linux kernel driver , it's plus if familiar with Yocto
3. Familiar with Qualcomm platform is plus
Interview process
直接面試
About us
我們是 【台灣創通聯達智能技術有限公司 Thundercomm】
由【高通 Qualcomm 】與【中科創達(Thundersoft】在2016年共同出資設立。
依托高通全球領先的芯片技術，以及中科創達強大的操作系統技術和本地化服務能力，創通聯達在智能相機、機器人、虛擬現實設備、可穿戴設備、無人機、醫療設備及工業物聯網等智能硬件領域不斷深耕，致力幫助客戶及合作夥伴加速智能硬件產品從原型到上市的過程。
台灣創通聯達智能技術有限公司（Thundercomm）
是一家致力於為物聯網領域的OEM/ODM廠商、創新企業以及開發者提供智能硬件產品、技術及一站式服務的供應商。
公司影片1： https://www.youtube.com/watch?v=1TmVYYg2vQk&t=3s
公司影片2 ：https://www.youtube.com/watch?v=NYFrfi-pdxU
公司影片3 ：https://www.youtube.com/watch?v=qpA8rYw_0Uw
