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Engineering
As a Principal Engineer you will have developed an expertise in a particular field of engineering or within a particular sector. You will have lead design teams through full product development and into production. As a Principal, you will be expected to demonstrate a level of expertise in a particular area that matches or exceeds the expertise of our customers. You will consult on system architectures, assess technical requirements and competencies needed during quoting and oversee design
3M ~ 3.5M TWD / year
15 years of experience required
No management responsibility
Circuit board design to full fill each customized or prototyping products; board layout review with full responsibility to guarantee circuit with full functional operation after manufacturing. The whole development period that have to align with internal PMs requirement. Travel, co-operation, technical communication with outside customers, ODMs, OEMs and internal PMs, FWs, EMS is necessary. Be realized what functionalities which required from customers and risks assessment before design kick-off
1.5M ~ 2M TWD / year
3 years of experience required
No management responsibility
[電源研發工程師] 工作內容 1. DC/DC或AC/DC電源開發設計 2. 依產品設計規格需求挑選電子元件 3. 開發樣品製作/組裝/測試及設計開發資料撰寫 4. 電源EMC、安規驗證問題解決
1.2M ~ 2.5M TWD / year
3 years of experience required
No management responsibility
負責Adapter設計研發工作 協助產品專案執行、測試、驗證與量產導入 AC/DC or DC/DC 電路設計、除錯 Charger 線路設計應用
1M ~ 1.5M TWD / year
3 years of experience required
No management responsibility
工作內容 Analog & Digital Circuits Design AC/DC,DC/DC power design 使用OrCad 繪製電路圖，DC/DC Power Designing, 設計包含電流自檢, 電壓自檢, OCP, OVP, OTP等電路,電路控制CPLD/FPGA, 負責FCT 專案的研發, Wireless Board 的設計 與客戶溝通達到客戶產品測試
700K ~ 1.8M TWD / year
6 years of experience required
No management responsibility
★關於頎邦科技 頎邦科技(CB)為全球最大LCD顯示器驅動IC封裝測試廠商，也是目前國內唯一有能力完成LCD驅動IC全程封裝測試之公司，可提供凸塊代工客戶Total Solution的解決方案。此外，CB也提供完善
35K ~ 45K TWD / month
No requirement for relevant working experience
No management responsibility
1.設計並研發能達成計畫目標的健全且高品質產品之生產組裝程序。 2.運用標準文件編製有效率的紀錄製造及組裝規格。 3.與LPD團隊和工廠內各部門探討問題的解決方法。 4.有效的
40K ~ 50K TWD / month
1 years of experience required
No management responsibility
【工作內容】 機台裝機、具半導體工廠經驗佳 【上班時間】 做三休三，需輪早晚班(一個月一輪) 日班07:30~19:30、晚班19:30~07:30 【薪資福利】 月薪40,000~45,000起，有相關經驗者可再議 輪班津貼:日班300/日、晚班500
1. 自動化方案評估、專案管理 2. 具拆圖及 BOM 展開能力, 熟悉機械零件選用規則 3. 2D/3D 繪圖能力 4. 自動化或製程機台機構設計 5. 熟悉加工工程及廠商對應與管理 6. 熟悉自動化
38K ~ 80K TWD / month
2 years of experience required
No management responsibility
【工作內容】 1. 嵌入式系統微處理器驅動程式開發 (Microchip/NXP/Ti) 2. 軟體程式模組設計與開發 (C/C++) 3. 專案開發研擬客戶需求與規格制定 4. 樣品開發與零組件功能研發與驗證 以
40K ~ 60K TWD / month
3 years of experience required
No management responsibility
