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Taipei City, Taiwan
Mid-Senior level
Product platform HW system design integration Schematic design, PCB layout design and review RFQ/PRD research and feedback Component survey and technology study BOM creation and maintenance Circuit/system design developing , validation and debugging.
1.6M ~ 1.8M TWD / month
10 years of experience required
No management responsibility
術支援，負責提供技術支援和解決方案，協助客戶解決硬體產品使用中的問題和困難 RFI／RFQ 評估與 Proposal 提案，並 Review MFG Test Plan & BOM Cost 確認Design Cost 達標 NPI／MP Productuin Line Support，確保DFM 滿足工廠製程能力並達到良率／UPH 目標
1.3M ~ 1.5M TWD / year
5 years of experience required
No management responsibility
上市電子公司 Outdoor small cell/O-RAN product development Spec definition component selection ME spec confirmation Embedded HW platform design (power, digital and RF integration), including Schematic drawing , BOM creation, layout, test plan creation Material preparation for sample build Support NPI to MP Product debug and test Customer support, include RFQ response, field try or on-site support
1.3M ~ 1.5M TWD / year
8 years of experience required
No management responsibility
預算,成本,推廣,銷售 3.全球3C周邊品牌及產品分析及差異化產品開發 4.供應鏈及生產管理 5.專案及跨部門溝通管理 6.產品規格/BOM/行銷資料制定及撰寫 7.完成主管交辦事項
戰，適合對運動有熱忱且想打造創新產品的你！ [ 工作內容 ] 1. 管理料件、備料與尋料 2. 電路板 layout 與基本配電 3. 產品量產與維修規劃 4. BOM 表維護與成本管控 5. 與廠商和軟體工程師溝通
800K ~ 1.3M TWD / year
5 years of experience required
No management responsibility
【工作內容】 1. 負責熱流與散熱設計及評估 2. 負責機構材料的設計及選用 3. 協助解決量產製造及製程中的散熱問題 4. 負責散熱零件BOM表及BOM之修正 5. 基礎熱流擬真軟體使用 6
製作工程樣品，並提供測試驗證報告 5. 驗證是否符合相容性與安全規範，並因應修改設計 6. BOM表建立與確認 7. 選用電子零件 8. 評估並驗證工程設計變更 9. 產品開發進度管理 10.
1M ~ 1.5M TWD / year
3 years of experience required
No management responsibility
