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Sianglin Yu(Rima)

*6 years extensive experience in high volume(>30K/month) product yield ramp-up and development in 8 inch Fab(tsmc). *2 years experience on CSP laminate product series from Memory IC packaging. Including 1.5 years R&D on NPI to mass production. Half year in customer support involve end to end turnkey service, final good to end customers. *1 year NPI PE on integrated RFCMOS Radar Transceiver.
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