Sianglin Yu(Rima)
*6 years extensive experience in high volume(>30K/month) product yield ramp-up and development in 8 inch Fab(tsmc).
*2 years experience on CSP laminate product series from Memory IC packaging. Including 1.5 years R&D on NPI to mass production. Half year in customer support involve end to end turnkey service, final good to end customers.
*1 year NPI PE on integrated RFCMOS Radar Transceiver.