二月 2018 - Present

Equipment Engineer leader

Advanced Semiconductor Engineering

1. Responsible for cross-department coordination of product anomaly resolution in yellow light equipment 

2. Project technical development and execution, evaluation of production line capacity requirements, and engineer manpower deployment.

3. Project progress management, such as process flow improvement planning, personnel task scheduling, overseeing teams of up to 5 individuals. 

4.Cross-departmental collaboration on various projects. 

5.Improvement of equipment maintenance processes, assessment of mechanical safety, and enhancement of mechanical operational efficiency. 

6.Cost control planning for various aspects.

Leading Engineering Projects

(Preventive Mechanism) TMAH Defects in Photoresist Products 

• Preventive Sprinkler System Implementation Introduction of Sprinkler System To prevent damage to the wafer circuits due to prolonged immersion in TMAH, when the immersion time exceeds the preset value, the sprinkler system is triggered to spray DI-Water to dilute the TMAT concentration, resulting in an 86.95% reduction in wafer scrap rate.

(Preventive Mechanism) Detection Mechanism for Tilted Plate on Coating Hot Plate. 

• Early Warning System to Prevent Wafer Fragmentation: Sensors are installed at three specific locations on the hot plate to detect fragments. If the Robot Paddle fails to place the wafer precisely on these points, triggering an alarm mechanism, the machine halts operation immediately and automatically dispatches for maintenance, reducing the probability of wafer fragmentation in the hot plate by 80%. 

(Cost Control)Photoresist Flow Reduction Improvement. 

• To save on photoresist costs, the spraying flow rate of photoresist required for each wafer operation was reduced from 4.5g to 4.2g. After conducting mass production experiments, it was confirmed that this photoresist flow rate would not cause any abnormality in the coating process. This reduction saves approximately 0.3g of spraying costs per wafer, resulting in a decrease of about 15 New Taiwan Dollars in manufacturing cost per wafer.  

(Operational Enhancement) Process Flow Improvement. 

• The transmission speed of the robotic arm of the photoresist coating machine was tested for improvement. Originally, the total time spent on picking and placing wafers was 35 seconds. After adjusting the transmission speed to the lowest acceptable safety value recommended by the manufacturer, the total transmission time was reduced to 31.5 seconds. Following a safety test with 1000 wafers, confirming no compromise to the safety of the transmission process, operations proceeded. The original WPH (Wafers Per Hour) rate was 65 pieces per hour, which has now been increased to 69 pieces per hour. 

(Manpower Loading Improvement)Implementation of Ultrasonic Cleaning System 

• The introduction of ultrasonic NMP (N-Methyl-2-pyrrolidone) immersion tanks and acetone immersion tanks has accelerated the total time required for maintenance and reduced the probability of production defects after equipment return. Previously, the cleaning of coating tanks relied solely on manual wiping by personnel, occasionally resulting in cleaning deficiencies such as dust deposition and dirt accumulation on the cover, leading to surface defects on wafers. With the implementation of ultrasonic cleaning tanks, the cleaning time for personnel has decreased from 1 hour to 45 minutes, resulting in a 71% reduction in the occurrence of surface abnormalities on wafers.