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Definition of Reputation Credits
曾濟彬 Casey Tseng
Looking for related job opportunities in the semiconductor field, working for United Microelectronics Corporation as an integration engineer for advanced technology development.
半導體工程師 Semiconductor Engineer
Email: [email protected]
EDUCATION
M.S. 成功大學微電子所 2015～2017
B.S. 成功大學電機工程系 2011～2015
M.S. on Microelectronic Engineering, National Cheng Kung University 2015 ~ 2017
- The effect of different silicon nitride passivation layer thickness on the AlGaN/GaN HEMT
- The sensing application of in gas and UV detecting by Zinc oxide nanorod gated AlGaN/GaN based HEMT sensor
B.S. on Electrical Engineering, National Cheng Kung University 2011 ~ 2015
- 10-bit 30-MS/s SAR ADC Using a Switchback2 Switching Method
- A 1-μW 10-bit 200-kS/s SAR ADC With a BypassWindow for Biomedical Applications
Working Experience
United Microelectronics Corporation, Advance Technology Process Integration Engineer, Oct 2017 ~ now
1. Participate advance technology logic process development （22nm, 28nm)
2. Work with related department to solve issue after analysis.
3. Identify potential problems in a process flow and apply appropriate solutions.
4. Lot control from wafer start to wafer out
5. Understand and use metrology/analytical techniques to identify processing-related defects, issues and make appropriate corrections.
6. Identify the failure mode and provide improvement guide to final test manufacturing site.
7. Co-work with related dept. to deal with customer related issues and set up process flow
8. Product trail production and yield improvement
United Microelectronics Corporation, Process Integration Intern, Jul 2016 ~ Aug 2016
1.Participate with 40,55nm project
2.Work with related department to solve WAT and yield related issue
SUMMARY
Since graduated from the Master's degree, I worked as an RD integration engineer at United Microelectronics Corporation ,responsible for advanced process wafer product development projects. Able to use semiconductor background knowledge to optimize the process and meet customer needs.
LANGUAGES
- Mandarin (native)
- English (Professional working proficiency) TOEIC 935 Golden certification
Extracurricular Activates
Leadership and capability to service are the main gains from my extracurricular activates.
- NCKU EE basketball team member
- Dali Kuo Guang rotaract club council member - Learning services and leadership skills, making snacks every weekend and teaching talent classes for disadvantaged children
- Yongling Hope Primary School project teacher - To counsel disadvantaged children after class
- Exchange program to Denmark, Belgium and China experience - capable to speak and cooperate with foreigners
- ALPHA camp student - Learning full stack web develop skills for interests
- Coursera - Programming for Business Computing in Python
曾濟彬 Casey Tseng
Looking for related job opportunities in the semiconductor field, working for United Microelectronics Corporation as an integration engineer for advanced technology development.
半導體工程師 Semiconductor Engineer
Email: [email protected]
EDUCATION
M.S. 成功大學微電子所 2015～2017
B.S. 成功大學電機工程系 2011～2015
M.S. on Microelectronic Engineering, National Cheng Kung University 2015 ~ 2017
- The effect of different silicon nitride passivation layer thickness on the AlGaN/GaN HEMT
- The sensing application of in gas and UV detecting by Zinc oxide nanorod gated AlGaN/GaN based HEMT sensor
B.S. on Electrical Engineering, National Cheng Kung University 2011 ~ 2015
- 10-bit 30-MS/s SAR ADC Using a Switchback2 Switching Method
- A 1-μW 10-bit 200-kS/s SAR ADC With a BypassWindow for Biomedical Applications
Working Experience
United Microelectronics Corporation, Advance Technology Process Integration Engineer, Oct 2017 ~ now
1. Participate advance technology logic process development （22nm, 28nm)
2. Work with related department to solve issue after analysis.
3. Identify potential problems in a process flow and apply appropriate solutions.
4. Lot control from wafer start to wafer out
5. Understand and use metrology/analytical techniques to identify processing-related defects, issues and make appropriate corrections.
6. Identify the failure mode and provide improvement guide to final test manufacturing site.
7. Co-work with related dept. to deal with customer related issues and set up process flow
8. Product trail production and yield improvement
United Microelectronics Corporation, Process Integration Intern, Jul 2016 ~ Aug 2016
1.Participate with 40,55nm project
2.Work with related department to solve WAT and yield related issue
SUMMARY
Since graduated from the Master's degree, I worked as an RD integration engineer at United Microelectronics Corporation ,responsible for advanced process wafer product development projects. Able to use semiconductor background knowledge to optimize the process and meet customer needs.
LANGUAGES
- Mandarin (native)
- English (Professional working proficiency) TOEIC 935 Golden certification
Extracurricular Activates
Leadership and capability to service are the main gains from my extracurricular activates.
- NCKU EE basketball team member
- Dali Kuo Guang rotaract club council member - Learning services and leadership skills, making snacks every weekend and teaching talent classes for disadvantaged children
- Yongling Hope Primary School project teacher - To counsel disadvantaged children after class
- Exchange program to Denmark, Belgium and China experience - capable to speak and cooperate with foreigners
- ALPHA camp student - Learning full stack web develop skills for interests
- Coursera - Programming for Business Computing in Python