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Avatar of 黃鈺惠.
Avatar of 黃鈺惠.
工程師 @台灣神隆股份有限公司
2021 ~ Hiện tại
工程師
Hơn một năm
筒電解脫模 5.評估整體生產流程 Process Engineer Responsibilities: - Seamless NIL technology R&D - Electroforming process control and improvement - Roll to roll production technology - Photo-resist coating process control and improvement - Process integration Awards and Key Contributions: - New process(Seamless NIL) scale-up - Integrate process of fabricating seamless cylinder - Develop electrolysis demolding process 十一月十二月 2017 製程工程師 奇美材料科技股份有限公司 1.電鑄製程監控與分析改善 2
word
powerpoint
excel
Đã có việc làm
Full-time / Quan tâm đến làm việc từ xa
4-6 năm
國立成功大學
機械工程系
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Avatar of the user.
工程師 @台泥資訊
2021 ~ Hiện tại
工程師
Trong vòng một năm
Word
PowerPoint
Excel
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Full-time / Quan tâm đến làm việc từ xa
4-6 năm
中央大學
資訊工程學系
Avatar of 余威徵.
Ngoại tuyến
Avatar of 余威徵.
Ngoại tuyến
Senior manager @Lexta隆達電子
2010 ~ Hiện tại
工程師
Hơn một năm
roadmap presenting...etc. 4. Lead a team of 17 members, and cooperate with whole PKG/LB PD team in LEX for new product development. The business includes conventional PLCC for lighting & backlight unit, molding type LED for automobile appl., and CSP(chip scale package) for cost effective backlight appl as well. 5. MiniLED proJect leader, in charge of chip design & widen emitting angle technology development. Lextar隆達電子, Principle engineer, Sep 2009 ~ NovBEOL process engineer. 2. Familiar in laser scribing and AOI instruments% cost down
AutoCAD
Excel
Full-time / Quan tâm đến làm việc từ xa
6-10 năm
國立中正大學
物理, 光電, 雷射

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Technical Skills
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Problem-Solving
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Hơn một năm
Senior manager of chip development department
Logo of Lexta隆達電子.
Lexta隆達電子
2010 ~ Hiện tại
Hsinchu City, Taiwan 300
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國立中正大學
Chuyên ngành
物理, 光電, 雷射
In
Rd3pgiafwqbex60xerkm

余威徵 Yu, Wei-cheng

I am Kevin Yu, familiar in LED chip development. I’m capable in several chip design, which are miniLED backlighting, flip chip, vertical chip, and conventional lateral chip process/structure development. I am also key-account contact window for RD service since 2012.

Electrical and optical engineering
HsinChu,TW
[email protected]

工作經歷

Lexta隆達電子, Senior manager, Nov 2010 ~ 現在

1. Chip product development from 2010 to now. 

2. R&D service contact window for key accounts since 2012. 

3. Project management for worldwide customers, including sample providing, DQA procedure, qual. plan setup/report, technology roadmap presenting...etc. 

4. Lead a team of 17 members, and cooperate with whole PKG/LB PD team in LEX for new product development. The business includes conventional PLCC for lighting & backlight unit, molding type LED for automobile appl., and CSP(chip scale package) for cost effective backlight appl as well. 

5. MiniLED proJect leader, in charge of chip design & widen emitting angle technology development.


Tqx5uoi4wy5vbnloizfx

Lextar隆達電子, Principle engineer, Sep 2009 ~ Nov 2010

1. BEOL process engineer. 

2. Familiar in laser scribing and AOI instruments. 

3. 20% cost down achievement in 2009-2010.

Nlqknbxcyizxreg2bqm3

學歷

國立中正大學Chung-cheng university, 碩士學位Master's degree, 物理Physics, 光電, 雷射, 2006 ~ 2008

1. Research topic : High-field & Ultra-fast technology. 

2. Familiar in optical components & solid-state laser system setup.

Idrfdlxoanr3umezv8hj
Resume
Hồ sơ của tôi
Rd3pgiafwqbex60xerkm

余威徵 Yu, Wei-cheng

I am Kevin Yu, familiar in LED chip development. I’m capable in several chip design, which are miniLED backlighting, flip chip, vertical chip, and conventional lateral chip process/structure development. I am also key-account contact window for RD service since 2012.

Electrical and optical engineering
HsinChu,TW
[email protected]

工作經歷

Lexta隆達電子, Senior manager, Nov 2010 ~ 現在

1. Chip product development from 2010 to now. 

2. R&D service contact window for key accounts since 2012. 

3. Project management for worldwide customers, including sample providing, DQA procedure, qual. plan setup/report, technology roadmap presenting...etc. 

4. Lead a team of 17 members, and cooperate with whole PKG/LB PD team in LEX for new product development. The business includes conventional PLCC for lighting & backlight unit, molding type LED for automobile appl., and CSP(chip scale package) for cost effective backlight appl as well. 

5. MiniLED proJect leader, in charge of chip design & widen emitting angle technology development.


Tqx5uoi4wy5vbnloizfx

Lextar隆達電子, Principle engineer, Sep 2009 ~ Nov 2010

1. BEOL process engineer. 

2. Familiar in laser scribing and AOI instruments. 

3. 20% cost down achievement in 2009-2010.

Nlqknbxcyizxreg2bqm3

學歷

國立中正大學Chung-cheng university, 碩士學位Master's degree, 物理Physics, 光電, 雷射, 2006 ~ 2008

1. Research topic : High-field & Ultra-fast technology. 

2. Familiar in optical components & solid-state laser system setup.

Idrfdlxoanr3umezv8hj