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Taiwan
Taoyuan City, Taiwan
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Taoyuan City, Taiwan
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Reliability / Firmware Engineer
資深工程師, 經理
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HTC 宏達國際電子股份有限公司
中強光電股份有限公司
圓展科技股份有限公司
璟昇科技股份有限公司-美商ID TECH台灣分公司
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Avatar of 施志欣.
Avatar of 施志欣.
施志欣
Senior Engineer @璟昇科技股份有限公司-美商ID TECH台灣分公司
・
2021 ~ 2022
資深工程師, 經理
Within three months
施志欣 我有10年的資訊相關經驗，包含Windows, Android，VR及AR軟體開發，及Android kernel, framework經驗，也具有一些網路開發經驗，，熟悉Windows, Linux 平台操作，能與硬體集成提供完整系統、軟體solutions mobile:資深工程師, 經理 Taipei，TW [email protected] 工作經歷 璟昇科技股份有限公司-美商ID TECH
+c/c++
+java
+c#
Employed
Full-time / Interested in working remotely
10-15 years
中央大學
・
Computer Science and Information Engineering
Avatar of Hank Wu.
Offline
Avatar of Hank Wu.
Offline
Hank Wu
Senior SSD reliability Engineer @SMART Modular Technologies
Reliability / Firmware Engineer
Within one year
吳柏漢 / Hank Wu · Familiar with NAND flash operations and NAND flash file system. · Developing and resolving problems related to NAND flash product reliability. · Designing and executing experiments to characterize NAND array reliability mechanisms, physical and empirical reliability modeling and field failure rate estimation. · Driving NAND failure analysis and identify root cause. · Developing algorithms and solutions for NAND flash testing. · SD/SSD product failure analysis and identify root cause. Senior SSD Reliability Engineer [email protected] Skills Programming Language / Environment and tool C MFC QT Technologies / Knowledge
+c/c++
Full-time / Interested in working remotely
4-6 years
中原大學
・
NAND Flash product reliability
50+

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Definition of Reputation Credits

Technical Skills
Specialized knowledge and expertise within the profession (e.g. familiar with SEO and use of related tools).
Problem-Solving
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Adaptability
Ability to navigate unexpected situations; and keep up with shifting priorities, projects, clients, and technology.
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Within one year
Avatar of Hank Wu.
Hank Wu
Senior SSD reliability Engineer @ SMART Modular Technologies
台灣桃園
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4-6 years
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Reliability / Firmware Engineer
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Print
Profile 03 00@2x

吳柏漢 / Hank Wu

· Familiar with NAND flash operations and NAND flash file system.
· Developing and resolving problems related to NAND flash product reliability.
· Designing and executing experiments to characterize NAND array reliability  
  mechanisms, physical and empirical reliability modeling and field failure rate      estimation.
· Driving NAND failure analysis and identify root cause.
· Developing algorithms and solutions for NAND flash testing.
· SD/SSD product failure analysis and identify root cause.

Senior SSD Reliability Engineer
[email protected]

Skills

Programming Language / Environment and tool

  • C
  • MFC 
  • QT

Technologies / Knowledge

  • NAND Flash Architecture/Analyzer
  • NAND Flash Characteristic Analysis
  • NAND Flash Testing Firmware Developing
  • Failure analysis


Language

  • Chinese
  • English

Work Experience

SMART Modular Technologies, SSD Reliability Engineer / Senior SSD Reliability Engineer，Jan. 2016 - now

  • Responsibilities : 

NAND Flash characteristic analysis.

  1. Developing and resolving problems related to NAND flash product reliability. 
  2. Designing and executing experiments to characterize NAND array reliability mechanisms, physical and empirical reliability modeling and field failure rate estimation. 

Designing and developing NAND reliability test and NAND test tool. 

  1. Developing algorithms and solutions for NAND flash testing. 
  2. Developing special Firmware and Test Tool for NAND characteristic validation. 

SSD/SD products failure analysis and root cause identify

  1. Driving NAND failure analysis and identify root cause.
  2. Logical Analyzer for debugging and analyzing NAND signals.

  • Attended Projects : 

  1. TSB A19nm MLC characteristic analysis.
  2. TSB 15nm MLC characteristic analysis.
  3. TSB BiCS3 TLC characteristic analysis.
  4. Micron L06B MLC characteristic analysis.
  5. Micron B17A TLC characteristic analysis.
  6. OEM product failure analysis.

SMART Modular Technologies, Firmware Engineer，Nov. 2013 - Dec. 2015

  • Responsibilities : 

  1. Production Validation and Auto-Testing Firmware development
  2. Production automatic test firmware development.
  3. Production vendor CMD tool developing.
  4. Designing and executing NAND Flash characteristic analysis test.

  • Attended Projects :

  1. eMMC product project.
  2. Product quality and reliability test

Education

Chung Yuan Christian University, Master's Degree, Department of Information & Computer Engineering, 2011 - 2013 


Chung Yuan Christian University, Bachelor, Department of Information & Computer Engineering, 2006 - 2010


Resume
Profile
Print
Profile 03 00@2x

吳柏漢 / Hank Wu

· Familiar with NAND flash operations and NAND flash file system.
· Developing and resolving problems related to NAND flash product reliability.
· Designing and executing experiments to characterize NAND array reliability  
  mechanisms, physical and empirical reliability modeling and field failure rate      estimation.
· Driving NAND failure analysis and identify root cause.
· Developing algorithms and solutions for NAND flash testing.
· SD/SSD product failure analysis and identify root cause.

Senior SSD Reliability Engineer
[email protected]

Skills

Programming Language / Environment and tool

  • C
  • MFC 
  • QT

Technologies / Knowledge

  • NAND Flash Architecture/Analyzer
  • NAND Flash Characteristic Analysis
  • NAND Flash Testing Firmware Developing
  • Failure analysis


Language

  • Chinese
  • English

Work Experience

SMART Modular Technologies, SSD Reliability Engineer / Senior SSD Reliability Engineer，Jan. 2016 - now

  • Responsibilities : 

NAND Flash characteristic analysis.

  1. Developing and resolving problems related to NAND flash product reliability. 
  2. Designing and executing experiments to characterize NAND array reliability mechanisms, physical and empirical reliability modeling and field failure rate estimation. 

Designing and developing NAND reliability test and NAND test tool. 

  1. Developing algorithms and solutions for NAND flash testing. 
  2. Developing special Firmware and Test Tool for NAND characteristic validation. 

SSD/SD products failure analysis and root cause identify

  1. Driving NAND failure analysis and identify root cause.
  2. Logical Analyzer for debugging and analyzing NAND signals.

  • Attended Projects : 

  1. TSB A19nm MLC characteristic analysis.
  2. TSB 15nm MLC characteristic analysis.
  3. TSB BiCS3 TLC characteristic analysis.
  4. Micron L06B MLC characteristic analysis.
  5. Micron B17A TLC characteristic analysis.
  6. OEM product failure analysis.

SMART Modular Technologies, Firmware Engineer，Nov. 2013 - Dec. 2015

  • Responsibilities : 

  1. Production Validation and Auto-Testing Firmware development
  2. Production automatic test firmware development.
  3. Production vendor CMD tool developing.
  4. Designing and executing NAND Flash characteristic analysis test.

  • Attended Projects :

  1. eMMC product project.
  2. Product quality and reliability test

Education

Chung Yuan Christian University, Master's Degree, Department of Information & Computer Engineering, 2011 - 2013 


Chung Yuan Christian University, Bachelor, Department of Information & Computer Engineering, 2006 - 2010