Hsinchu, Hsinchu City, Taiwan
I work in AUO, My main mission is making uLED brightness and thickness. We show a lot of new products in touch taiwan. To pursuit high reselution and colorful contract. Let display to be curved and rolled. I push myself to learn more new information to make my product better. Get some patents for optcal structure.
In preceding period of Lextar, I major in package product design engineer of 5630 and 3030. I learned LED knowledge of chip and package process about die bond, wire bond, dispensing and reflow. I could use the material of lead-frame, phosphor, wire and chip to match different product spec. of CRI and CCT and reliability. Except customer request, we benchmark other competition products, and using SEM, X-ray and grind to analyses samples.
In Suzhou I accept new challenge to lead Light Bar team for new project. I learn more technology of LB process and proposal of specification. We combine LED and PCB to accord to thermal dissipation and safety of UL and CE.
I was a engineer of thin film in UMC. The major job is design ULKCVD(Ultra-low K CVD) and do new experiments. Experiments of RC decay could be low by reducing K-factor. Let constructs would not be weak after curing. UMC trained me to learn more process of NDC, TEOS and SION etc. We co-worked with other department about Etch, Photo and Diffusion. I use Film Metrology Tools(Aleris 8300) to measure thickness, RI, U% and Stress measurement.
I have consistently exceeded my targets and I am able to successfully work under pressure and multi-task efficiently. As an avid cyclist and user of many of your products. I am confident that my experience, communication skills, and ability can convey product benefits effectively would enable me to excel in the sales role. I look forward to hearing from you.
五月 2020 - Present
- Design Optical innovation of Micrfo-LED
- Plan and test Demo for vehicular automatic display
- Familiar with various manufacturing process included Photolithography and Etching
六月 2019 - 一月 2020
-Responded to teach customers using Arcteryx product of waterproof ondoor.
-Assisted customers to solve issue in warranty.
三月 2017 - 六月 2018
- Supervision of light-bar design team that included four staff members
- Planed and directed all phases of team operations
- Coordinated SMT process in the factory
- Explored new customers such as Osram, Acuity and Cooledge (companies that use light
products)
八月 2014 - 二月 2017
- Designed LED package products of 5630 and 3030 for Osram
- Outsourced material to improve efficiency and reliability of products
- Coordinating all process from EVT to MP
- Pperated machine of SEM and integrating sphere
- Initiated lifetime test about LM_80 and TM-21
九月 2013 - 五月 2014
- Designed and produced ULKCVD and ECP Cu
- Reduced K-factor CIP of ELK dielectric film for RC delay reduction
- Improved Cu layer thickness U%
- Co-worked with other departments with Etch, Photo and Diffusion
六月 2011 - 九月 2011
- learned process of lens and light-guide
- simulated camera design
2019 - 2019
2010 - 2012
2005 - 2010
Hsinchu, Hsinchu City, Taiwan
I work in AUO, My main mission is making uLED brightness and thickness. We show a lot of new products in touch taiwan. To pursuit high reselution and colorful contract. Let display to be curved and rolled. I push myself to learn more new information to make my product better. Get some patents for optcal structure.
In preceding period of Lextar, I major in package product design engineer of 5630 and 3030. I learned LED knowledge of chip and package process about die bond, wire bond, dispensing and reflow. I could use the material of lead-frame, phosphor, wire and chip to match different product spec. of CRI and CCT and reliability. Except customer request, we benchmark other competition products, and using SEM, X-ray and grind to analyses samples.
In Suzhou I accept new challenge to lead Light Bar team for new project. I learn more technology of LB process and proposal of specification. We combine LED and PCB to accord to thermal dissipation and safety of UL and CE.
I was a engineer of thin film in UMC. The major job is design ULKCVD(Ultra-low K CVD) and do new experiments. Experiments of RC decay could be low by reducing K-factor. Let constructs would not be weak after curing. UMC trained me to learn more process of NDC, TEOS and SION etc. We co-worked with other department about Etch, Photo and Diffusion. I use Film Metrology Tools(Aleris 8300) to measure thickness, RI, U% and Stress measurement.
I have consistently exceeded my targets and I am able to successfully work under pressure and multi-task efficiently. As an avid cyclist and user of many of your products. I am confident that my experience, communication skills, and ability can convey product benefits effectively would enable me to excel in the sales role. I look forward to hearing from you.
五月 2020 - Present
- Design Optical innovation of Micrfo-LED
- Plan and test Demo for vehicular automatic display
- Familiar with various manufacturing process included Photolithography and Etching
六月 2019 - 一月 2020
-Responded to teach customers using Arcteryx product of waterproof ondoor.
-Assisted customers to solve issue in warranty.
三月 2017 - 六月 2018
- Supervision of light-bar design team that included four staff members
- Planed and directed all phases of team operations
- Coordinated SMT process in the factory
- Explored new customers such as Osram, Acuity and Cooledge (companies that use light
products)
八月 2014 - 二月 2017
- Designed LED package products of 5630 and 3030 for Osram
- Outsourced material to improve efficiency and reliability of products
- Coordinating all process from EVT to MP
- Pperated machine of SEM and integrating sphere
- Initiated lifetime test about LM_80 and TM-21
九月 2013 - 五月 2014
- Designed and produced ULKCVD and ECP Cu
- Reduced K-factor CIP of ELK dielectric film for RC delay reduction
- Improved Cu layer thickness U%
- Co-worked with other departments with Etch, Photo and Diffusion
六月 2011 - 九月 2011
- learned process of lens and light-guide
- simulated camera design
2019 - 2019
2010 - 2012
2005 - 2010