Joyce Chu My name is Joyce Chu. I have worked at Chipbond since 2017 and in charge of bumping and sometimes need to cooperate with probe and DPS team to figure out some engineering issues. So, I am very good at bumping process and basic probe and DPS knowledge are both no problem as well. I am the person with high pressure resistance, determination and persistence. Taiwan Province, Taiwan Work Experience Senior engineer • CHIPBOND 2017/4 - Present 1. NPI project: mask drawing design by using K-layout and AutoCAD and do the risk assessment

goals set by the higher authorities. Delivering valuable customer service. Office Assistance • Sahara India OctoberJuly 2000 Supported the Branch Manager and other seniors in handling all of their responsibilities and was present for any assistance if required. With all emphasis towards learning from my seniors and colleagues.. EducationRANCHI UNIVERSITY M. ComRajendra Institute of Management Studies Post Graduate Diploma in Business ManagementYOGODA SATSANGA MAHAVIDYALA B.Com. (Hons.) Languages Hindi — Professional English — Fluent Skills Problem Solving Ability • Delegation high endurance against stress • Decision Making Organizational /Managerial Skills Customer Service Communication Skills Teamwork