Senior engineer  •  CHIPBOND

2017/4 - Present

1. NPI project: mask drawing design by using K-layout and AutoCAD and do the risk assessment according to design rule.
2. Yield improvement: cooperate with factory to improve the yield to 99.9% for NPI and MP(mass production) project.
3. Develop compound wafer(GaN, SiC, SiGe, GaAs) technology with customer and below are some examples:
3.1. GaN with PI+Cu RDL+Pillar is on NPI stage so do the risk assessment and inform customer there will be a risk of Cu RDL oxidation. Completing bumping process, check die appearance and the result is no oxidation before shipping.
3.2. Factory doesn't have the experience of GaN with 10000um thickness so evaluate machine robot and cassette to satisfy customer's request and the result is positive.
Besides, the benefit is decrease the risk of wafer broken because of stress reduction which is GaN with 1000um thickness can proceed to factory directly without grinding to 675um.
4. Develop new process flow or capability with factory according to customer's requirement( ex: use double dry film to satisfy the Pillar height)
5. RMA failure analysis ( SEM, X-section, EDS, FIB, Hot spot, and IV curve..ect.) and send summary report to customer. (ex: CP low yield highlighted by Assembly)
6. Cooperate with CP(probe) and DPS(dicing to tape and reel) team to deal with customer's request.(ex: some issues about map merge).
7. Customer's audit: fab line tour with customer and introduce each process and machine.