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Definition of Reputation Credits
沈書弘 Neo Shen
Hi~我是Neo，我擁有13年以上半導體設備經驗，目前主要負責為laser saw及blade saw專案改善及異常排除。
在此之前也曾負責wafer taping、grinding、laser grooving、wafer saw等機台維修保養及改善。
資深設備工程師
+886-910-542-868
Taoyuan，Taiwan
工作經歷 Experience
WIN Semiconductors｜Equipment engineer｜Jun 2019 ~ 至今
穩懋半導體, 資深設備工程師
負責項目:
為部門切割機台負責人，主要負責雷射、刀片切割機維修、保養，改善專案及人員教育訓練。
ASE, Inc.｜Equipment supervisor｜Mar 2011 ~ Jun 2019
日月光半導體製造股份有限公司, 設備主任
負責項目:
設備維修、保養、提升機台稼動率、產品檢測、新進人員教育訓練等，並帶領一個25人團隊
Mercuries Life Insurance｜Salesman｜Jul 2010 ~ Mar 2011
三商美邦人壽股份有限公司, 壽險業務員
負責項目:
提供客戶壽險保障、投資理財相關訊息
CMC｜Technician｜Nov 2009 ~ Jun 2010
中環股份有限公司, 技術員
負責項目:
執行模壓機、染料塗怖、鍍膜機保養、操作
工作技能 Skills
Good at Equipment
- Accretech(TSK) Grinding
- DISCO Grinding
- OKAMOTO Grinding
- DISCO Laser Dicing
- DISCO Dicing saw
- ASM Laser Dicing
- Lintec DR3000III Taping
Computer
- Word
- Excel
- Powerpoint
- Lotus
License
- Industrial Electronics Class C
- TQC-OA - Chinese typing
學歷 Education
健行科技大學, 學士學位, 電子工程系, 2006 ~ 2008
南開科技大學, 副學士學位, 電子工程系, 2001 ~ 2006
改善專案 Projects
參與公司各項改善案，有效的增加人員效率及機台產出(產出4000片/日提升至5500片/日)，並大幅降低異物所造成晶圓裂片異常(30片/月下降至15片/月)，幫助公司提升獲利。
自傳 Autobiography
我是沈書弘，我擅長發揮創意與想像力，解決自己遇上的難題，我有正面積極的態度、勇於挑戰，對生活充滿熱情，期盼在工作上能有傑出的表現。我畢業於健行科技大學電子工程系，曾修習工業電子與電路學，累積成為設備工程師的能力。此外，我喜歡嘗試新事物與新方法，我總能善用學校的資源並精進相關領域的專業知識。我也參加許多課外活動，使我的應變能力以及創新能力出現高度的成長。
我目前在穩懋半導體擔任設備工程師，負責的工作內容為laser saw及blade saw專案改善及異常排除。
在此之前也曾在日月光半導體擔任設備主任，主要負責人員教育訓練、機台維修、提升機台稼動率、產品檢測等..。
謝謝您抽空閱讀我的個人履歷，若您目前正在尋求工程師相關人才，請考慮錄用我。我對於工程師等工作內容相當熟悉，也充滿了熱情與興趣。希望能進入貴公司這個大家庭，共同為美好的未來奮鬥努力。
沈書弘 Neo Shen
Hi~I am Neo, I have more than 13 years experience in semiconductor equipment, currently I am mainly responsible for the improvement of laser dicing and wafer saw.
Prior to this, I was also responsible for the maintenance and improvement of wafer taping, grinding, laser grooving, wafer saw and other machines.
Equipment engineer
+886-910-542-868
Taoyuan，Taiwan
Experience
WIN Semiconductor｜Equipment engineer｜Jun 2019 ~ Present
Machine maintenance, preventive maintenance, Improvement projects and personnel education and training
ASE, Inc.｜Equipment supervisor｜Mar 2011 ~ Jun 2019
Machine maintenance, preventive maintenance, Increase yield, product testing, etc...
Mercuries Life Insurance｜Salesman｜Jul 2010 ~ Mar 2011
Provide customer life insurance, investment and financial related information
CMC｜Technician｜Nov 2009 ~ Jun 2010
Machine maintenance, preventive maintenance
Skills
Good at equipment
- Accretech(TSK) Grinding
- DISCO Grinding
- OKAMOTO Grinding
- DISCO Laser Grooving
- DISCO Dicing saw
- ASM Laser Dicing
- Lintec DR3000III Taping
Computer
- Word
- Excel
- Powerpoint
- Lotus
License
-
Industrial Electronics Class C
- TQC-OA - Chinese typing
Education
Chien Hsin University of Science and Technology｜2006 ~ 2008
Bachelor of Science in Electronic Engineering
Nan Kai University of Technology｜2001 ~ 2006
Associate of Science in Electronic Engineering
Projects
In charge of the company's improvement project, effectively reducing the staff's loading (GD manpower from 24 reduce to 20), enhance GD produce efficiency and machines UPH(day out put from 4000 pcs to 5500 pcs), and major commitment to improving productivity and reducing the abnormalities of wafer crack(crack PPM from 30 reduce to 15). In addition to the establishment of new production lines to expand UPH and installed machinery to upgrade and automate the production process to improve on efficiency
Autobiography
I am Neo Shen. I am good at creativity and imagination, and solve the problems I have encountered. I have a positive attitude, a courage to challenge, a passion for life, and I hope to have outstanding performance in my work. I graduated from college of education from Chien Hsin University of Science and Technology, majoring in electronics and circuitry. During my studies, I worked hard to learn about electronic knowledge and ability to analyze problems so that it could train myself to be an excellent engineer. In addition, I like to try new things and new methods. I always make good use of the school resources and professional knowledge in related fields. I also participated in many extracurricular activities, which made my resilience and innovation ability also grow at a high level.
Currently I am working as an equipment engineer at WIN Semiconductor, and I am responsible for improving and troubleshooting laser dicing and blade saw projects.
Prior to this, I used to work at ASE Semiconductor as the equipment supervisor, mainly responsible for personnel education and training, machine maintenance, machine utilization rate improvement, product testing, etc...
Thank you for taking the time to read my resume. If you are currently looking for engineers, please consider hiring me. I am familiar with the work of engineers and so on, but also full of enthusiasm and interest. I hope to enter this big family of your company and work together for a better future.
沈書弘 Neo Shen
Hi~我是Neo，我擁有13年以上半導體設備經驗，目前主要負責為laser saw及blade saw專案改善及異常排除。
在此之前也曾負責wafer taping、grinding、laser grooving、wafer saw等機台維修保養及改善。
資深設備工程師
+886-910-542-868
Taoyuan，Taiwan
工作經歷 Experience
WIN Semiconductors｜Equipment engineer｜Jun 2019 ~ 至今
穩懋半導體, 資深設備工程師
負責項目:
為部門切割機台負責人，主要負責雷射、刀片切割機維修、保養，改善專案及人員教育訓練。
ASE, Inc.｜Equipment supervisor｜Mar 2011 ~ Jun 2019
日月光半導體製造股份有限公司, 設備主任
負責項目:
設備維修、保養、提升機台稼動率、產品檢測、新進人員教育訓練等，並帶領一個25人團隊
Mercuries Life Insurance｜Salesman｜Jul 2010 ~ Mar 2011
三商美邦人壽股份有限公司, 壽險業務員
負責項目:
提供客戶壽險保障、投資理財相關訊息
CMC｜Technician｜Nov 2009 ~ Jun 2010
中環股份有限公司, 技術員
負責項目:
執行模壓機、染料塗怖、鍍膜機保養、操作
工作技能 Skills
Good at Equipment
- Accretech(TSK) Grinding
- DISCO Grinding
- OKAMOTO Grinding
- DISCO Laser Dicing
- DISCO Dicing saw
- ASM Laser Dicing
- Lintec DR3000III Taping
Computer
- Word
- Excel
- Powerpoint
- Lotus
License
- Industrial Electronics Class C
- TQC-OA - Chinese typing
學歷 Education
健行科技大學, 學士學位, 電子工程系, 2006 ~ 2008
南開科技大學, 副學士學位, 電子工程系, 2001 ~ 2006
改善專案 Projects
參與公司各項改善案，有效的增加人員效率及機台產出(產出4000片/日提升至5500片/日)，並大幅降低異物所造成晶圓裂片異常(30片/月下降至15片/月)，幫助公司提升獲利。
自傳 Autobiography
我是沈書弘，我擅長發揮創意與想像力，解決自己遇上的難題，我有正面積極的態度、勇於挑戰，對生活充滿熱情，期盼在工作上能有傑出的表現。我畢業於健行科技大學電子工程系，曾修習工業電子與電路學，累積成為設備工程師的能力。此外，我喜歡嘗試新事物與新方法，我總能善用學校的資源並精進相關領域的專業知識。我也參加許多課外活動，使我的應變能力以及創新能力出現高度的成長。
我目前在穩懋半導體擔任設備工程師，負責的工作內容為laser saw及blade saw專案改善及異常排除。
在此之前也曾在日月光半導體擔任設備主任，主要負責人員教育訓練、機台維修、提升機台稼動率、產品檢測等..。
謝謝您抽空閱讀我的個人履歷，若您目前正在尋求工程師相關人才，請考慮錄用我。我對於工程師等工作內容相當熟悉，也充滿了熱情與興趣。希望能進入貴公司這個大家庭，共同為美好的未來奮鬥努力。
沈書弘 Neo Shen
Hi~I am Neo, I have more than 13 years experience in semiconductor equipment, currently I am mainly responsible for the improvement of laser dicing and wafer saw.
Prior to this, I was also responsible for the maintenance and improvement of wafer taping, grinding, laser grooving, wafer saw and other machines.
Equipment engineer
+886-910-542-868
Taoyuan，Taiwan
Experience
WIN Semiconductor｜Equipment engineer｜Jun 2019 ~ Present
Machine maintenance, preventive maintenance, Improvement projects and personnel education and training
ASE, Inc.｜Equipment supervisor｜Mar 2011 ~ Jun 2019
Machine maintenance, preventive maintenance, Increase yield, product testing, etc...
Mercuries Life Insurance｜Salesman｜Jul 2010 ~ Mar 2011
Provide customer life insurance, investment and financial related information
CMC｜Technician｜Nov 2009 ~ Jun 2010
Machine maintenance, preventive maintenance
Skills
Good at equipment
- Accretech(TSK) Grinding
- DISCO Grinding
- OKAMOTO Grinding
- DISCO Laser Grooving
- DISCO Dicing saw
- ASM Laser Dicing
- Lintec DR3000III Taping
Computer
- Word
- Excel
- Powerpoint
- Lotus
License
-
Industrial Electronics Class C
- TQC-OA - Chinese typing
Education
Chien Hsin University of Science and Technology｜2006 ~ 2008
Bachelor of Science in Electronic Engineering
Nan Kai University of Technology｜2001 ~ 2006
Associate of Science in Electronic Engineering
Projects
In charge of the company's improvement project, effectively reducing the staff's loading (GD manpower from 24 reduce to 20), enhance GD produce efficiency and machines UPH(day out put from 4000 pcs to 5500 pcs), and major commitment to improving productivity and reducing the abnormalities of wafer crack(crack PPM from 30 reduce to 15). In addition to the establishment of new production lines to expand UPH and installed machinery to upgrade and automate the production process to improve on efficiency
Autobiography
I am Neo Shen. I am good at creativity and imagination, and solve the problems I have encountered. I have a positive attitude, a courage to challenge, a passion for life, and I hope to have outstanding performance in my work. I graduated from college of education from Chien Hsin University of Science and Technology, majoring in electronics and circuitry. During my studies, I worked hard to learn about electronic knowledge and ability to analyze problems so that it could train myself to be an excellent engineer. In addition, I like to try new things and new methods. I always make good use of the school resources and professional knowledge in related fields. I also participated in many extracurricular activities, which made my resilience and innovation ability also grow at a high level.
Currently I am working as an equipment engineer at WIN Semiconductor, and I am responsible for improving and troubleshooting laser dicing and blade saw projects.
Prior to this, I used to work at ASE Semiconductor as the equipment supervisor, mainly responsible for personnel education and training, machine maintenance, machine utilization rate improvement, product testing, etc...
Thank you for taking the time to read my resume. If you are currently looking for engineers, please consider hiring me. I am familiar with the work of engineers and so on, but also full of enthusiasm and interest. I hope to enter this big family of your company and work together for a better future.