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Kuan-Ting Chen Physical design engineer with 10 years of experience working in the semiconductors industry. Skilled in cell-based ASIC/SoC implementation and power integrity (EM/IR) analysis methodology, especially for advanced nodes (7/6/5/4/3nm). Familiar with Tcl/Perl scripting and design automation. Coordinate technical support and customer engagement with close collaboration with EDA vendors. Organize technological education to partners/customers. Fluent in Mandarin and English (TOEFL: 105/120). [email protected], Taiwan Engineering Skills PHYSICAL DESIGN
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National Chiao Tung University
Chuyên ngành
Electronics Engineering
Kuan-Ting Chen
Physical design engineer with 10 years of experience working in the semiconductors industry. Skilled in cell-based ASIC/SoC implementation and power integrity (EM/IR) analysis methodology, especially for advanced nodes (7/6/5/4/3nm). Familiar with Tcl/Perl scripting and design automation. Coordinate technical support and customer engagement with close collaboration with EDA vendors. Organize technological education to partners/customers. Fluent in Mandarin and English (TOEFL: 105/120).[email protected]
+886-921672917
Hsinchu, Taiwan
Engineering Skills
PHYSICAL DESIGN
- Establish and deploy physical design methodology in advanced nodes (7/6/5/4/3nm)
- Design implementation from netlist to tape-out and PPA assessment in 7/6/5/4/3nm technologies
- Proven knowledge of Cadence Innovus and Synopsys ICC2/FusionCompiler backend design flow
- Familiar with Ansys Redhawk/Redhawk-CPA EM/IR methodology
- Coordinate technical support to customers in the above areas of profession
- Proactive and close collaboration with EDA vendors
- Conduct technological training courses and technical application notes for partners/customers
Education
NATIONAL CHIAO TUNG UNIVERSITY, 2011 - 2013
M. Sc. of Electronics Engineering
NATIONAL CHIAO TUNG UNIVERSITY, 2007 - 2011
B.S. of Electronics Engineering
Professional Experience
INTEL CORPORATION, 2022 - Present
Physical Design Engineer, Design Service Engineering
- 3DIC testchip execution
- Heterogeneous integration flow enablement
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD., 2019 - 2022
Principal Eningeer, Design Technology Platform
- 6nm HPC segment customer engagement, flow pipeclean, and project on-site field support
- 5/4/3nm HPC segment customer engagement, PPA assessment, and technical support
- 5/4/3nm node EDA enablement and certification program
- 20+ physical implementation flow trainings to customers in 7/6/5/3 nm technologies
GLOBAL UNICHIP CORPORATION, 2013 - 2019
Deputy Technical Manager, Design Service
- 7nm HPC peripheral block implementation (2M inst.; P&R, timing closure, DRC/LVS)
- 7nm GPU block implementation (1M inst.; P&R, path-finding, customer field support)
- 7nm physical design flow and DDR IP hardening (P&R, timing closure, DRC/LVS, field support)
- 5+ power integrity analysis projects in 28/16nm technology
- 20+ APR and/or power integrity project support experience in sub-28nm nodes
Kuan-Ting Chen
Physical design engineer with 10 years of experience working in the semiconductors industry. Skilled in cell-based ASIC/SoC implementation and power integrity (EM/IR) analysis methodology, especially for advanced nodes (7/6/5/4/3nm). Familiar with Tcl/Perl scripting and design automation. Coordinate technical support and customer engagement with close collaboration with EDA vendors. Organize technological education to partners/customers. Fluent in Mandarin and English (TOEFL: 105/120).[email protected]
+886-921672917
Hsinchu, Taiwan
Engineering Skills
PHYSICAL DESIGN
- Establish and deploy physical design methodology in advanced nodes (7/6/5/4/3nm)
- Design implementation from netlist to tape-out and PPA assessment in 7/6/5/4/3nm technologies
- Proven knowledge of Cadence Innovus and Synopsys ICC2/FusionCompiler backend design flow
- Familiar with Ansys Redhawk/Redhawk-CPA EM/IR methodology
- Coordinate technical support to customers in the above areas of profession
- Proactive and close collaboration with EDA vendors
- Conduct technological training courses and technical application notes for partners/customers
Education
NATIONAL CHIAO TUNG UNIVERSITY, 2011 - 2013
M. Sc. of Electronics Engineering
NATIONAL CHIAO TUNG UNIVERSITY, 2007 - 2011
B.S. of Electronics Engineering
Professional Experience
INTEL CORPORATION, 2022 - Present
Physical Design Engineer, Design Service Engineering
- 3DIC testchip execution
- Heterogeneous integration flow enablement
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD., 2019 - 2022
Principal Eningeer, Design Technology Platform
- 6nm HPC segment customer engagement, flow pipeclean, and project on-site field support
- 5/4/3nm HPC segment customer engagement, PPA assessment, and technical support
- 5/4/3nm node EDA enablement and certification program
- 20+ physical implementation flow trainings to customers in 7/6/5/3 nm technologies
GLOBAL UNICHIP CORPORATION, 2013 - 2019
Deputy Technical Manager, Design Service
- 7nm HPC peripheral block implementation (2M inst.; P&R, timing closure, DRC/LVS)
- 7nm GPU block implementation (1M inst.; P&R, path-finding, customer field support)
- 7nm physical design flow and DDR IP hardening (P&R, timing closure, DRC/LVS, field support)
- 5+ power integrity analysis projects in 28/16nm technology
- 20+ APR and/or power integrity project support experience in sub-28nm nodes