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Avatar of 洪維澤.
Avatar of 洪維澤.
EUV Equipment Engineer @台灣積體電路製造股份有限公司
2017 ~ Present
Mechanical / Thermal Engineer, Semiconductor Engineer
Within one year
N7+) - Mask defect improving - HVM fab savety (6S) control - New employee orientation Achievement - N7+ production on EUV - Reduce 25% mask defect - The most safety department of factory Mechanical and Thermal design (Ability Enterprise) Production - Security camera - Consumer camera - Sport/wearing camera Skill - Mechanical design - Thermal design and simulation - CAD/CAM software PTC-creo/COMSOL/Solidworks Customer - Huawei - Google - Sony - Fujifilm Education National Chiao Tung University, Master of mechanical engineering, 2012~2014 National Chung Cheng University, Bachelor of Mechanical engineering, 2008~2012 Work Experience TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: Aug 2017 ~ Now EUV senior Equipment Engineer
Auto CAD
COMSOL
CAD/CAM
Full-time
4-6 years
National Chiao Tung University
Master of Mechanical engineering

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Profile 00 00@2x e294063b2878e4164ba1dd904aa6b8bae6a97e19937899e4b4af853acf30de5d

Ray Lee

When learning more, then should be more humble.

Mechanical Design Engineer
New Taipei City. TW
[email protected]

+886 988 121 651

Work Experience

Mechanical 2nd Specialist, Quanta Computer Inc.  2020-Present

-Design metal parts and plastic parts to build Server 

-Resolve mechanical issues and concerns 

-Provide mechanical support with cross-functional teams 

-Review DFM of mechanical designs 

-Communicate with vendors

Mechanical Design Engineer, PHIHONG TECHNOLOGY CO.  2016-2019

-Design and Built 3D/2D for Power supply, Adapter, Charger

-DFM and Plastic injection Tooling review

-Drive and implement designs with cross-functional teams independently

-DC cord built & Strain relief design

-Be responsible for understanding and resolving all reliability concerns for designs

Work Experience

Education

Master of Mechanical Engineering, National Central Universary.  2014-2016

Master dissertation : 

Thermal Interface Materials For Heat Dissipation Applications in IGBT (Thermal simulation by using Comsol multiphysics)

Major : 

Finite Element Method

CAD/CAE

Elasticity

Vibration

Bachelor of Mechanical Engineering, Chung Yuan Christian Universary.  2010-2014

Skill


Creo (Pro/E), AutoCad

Apply to built 3D design and Engineering drawing.


Comsol multiphysics

Simulation software.

Apply to analysis structure issue.


MS Office

Management of Design data and Design verification. 

Language


Chinese



English

TOEIC 780 (Nov/2020)

Resume
Profile
Profile 00 00@2x e294063b2878e4164ba1dd904aa6b8bae6a97e19937899e4b4af853acf30de5d

Ray Lee

When learning more, then should be more humble.

Mechanical Design Engineer
New Taipei City. TW
[email protected]

+886 988 121 651

Work Experience

Mechanical 2nd Specialist, Quanta Computer Inc.  2020-Present

-Design metal parts and plastic parts to build Server 

-Resolve mechanical issues and concerns 

-Provide mechanical support with cross-functional teams 

-Review DFM of mechanical designs 

-Communicate with vendors

Mechanical Design Engineer, PHIHONG TECHNOLOGY CO.  2016-2019

-Design and Built 3D/2D for Power supply, Adapter, Charger

-DFM and Plastic injection Tooling review

-Drive and implement designs with cross-functional teams independently

-DC cord built & Strain relief design

-Be responsible for understanding and resolving all reliability concerns for designs

Work Experience

Education

Master of Mechanical Engineering, National Central Universary.  2014-2016

Master dissertation : 

Thermal Interface Materials For Heat Dissipation Applications in IGBT (Thermal simulation by using Comsol multiphysics)

Major : 

Finite Element Method

CAD/CAE

Elasticity

Vibration

Bachelor of Mechanical Engineering, Chung Yuan Christian Universary.  2010-2014

Skill


Creo (Pro/E), AutoCad

Apply to built 3D design and Engineering drawing.


Comsol multiphysics

Simulation software.

Apply to analysis structure issue.


MS Office

Management of Design data and Design verification. 

Language


Chinese



English

TOEIC 780 (Nov/2020)