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4-6 years
6-10 years
10-15 years
More than 15 years
United States
Offline
Offline
Past
Director, Semiconductor Packaging R&D @Texas Instruments2020 ~ 2023
・
Director or Managing Director above
Within one month
audits from key customers. Led team to solve customer incidents and returns to receive high customer satisfaction across Assembly and Test process. Led cross-function teams to drive site quality excellence. Reduced low tech error cases. Improved indices of 6 chronic defects to record low by engineering breakthrough. Chair of MRB (Material Review Board) to direct risk assessment to protect quality to customers. Chair of CCB (Change Control Board) to drive the process change risk assessment with improved quality. 十月十一月 2017 Taipei, Taiwan Manager, Assembly Process Engineering Texas Instruments
Unemployed
・
Ready to interview
Full-time / Interested in working remotely
More than 15 years
University of Michigan
・
Mechanical Engineering / Industrial Engineering
Test Engineer @TALUS Manufacturing Ltd.2016 ~ Present
・
Senior Engineer
More than one year
. Zhongli District, Taoyuan City, Taiwan Work Experience Test Engineer TALUS Manufacturing Ltd. • 十月Present Semiconductor equipment product transition Production issue analyze Production reduces labor hour Equipment troubleshooting Trainer Planner 介面光電股份有限公司 • 六 月五月 2016 Coordinate with operations, engineering, purchasing, and quality to attain production goals. Schedule the supply of materials/components to meet production requirements and minimum safety stock levels. EducationChien Hsin University of Science and Technology Electro-Optics and Communication Skills Training & Development Troubleshooting Skills Electrical Engineering Production Management Project Management Etch process
Employed
Full-time / Interested in working remotely
4-6 years
Chien Hsin University of Science and Technology
・
Electro-Optics and Communication
Intern @Snohomish Eye Care Clinic2015 ~ 2015
・
Embedded Software Engineer
Within two months
4-6 years
City University of Seattle
・
Masters of Science in Computer SciencePart-time / Interested in working remotely
4-6 years
Chaoyang University of Technology
・
Bachelor of Architecture The Most Lightweight and Effective Recruiting Plan
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Definition of Reputation Credits
Technical Skills
Specialized knowledge and expertise within the profession (e.g. familiar with SEO and use of related tools).
Problem-Solving
Ability to identify, analyze, and prepare solutions to problems.
Adaptability
Ability to navigate unexpected situations; and keep up with shifting priorities, projects, clients, and technology.
Communication
Ability to convey information effectively and is willing to give and receive feedback.
Time Management
Ability to prioritize tasks based on importance; and have them completed within the assigned timeline.
Teamwork
Ability to work cooperatively, communicate effectively, and anticipate each other's demands, resulting in coordinated collective action.
Leadership
Ability to coach, guide, and inspire a team to achieve a shared goal or outcome effectively.
Within one month
Director, Semiconductor Packaging R&D; Senior Member of Technical Staff
Texas Instruments
・
2020 ~ 2023
Professional Background
Current status
Unemployed
Job Search Progress
Ready to interview
Professions
Packaging Engineer
Fields of Employment
Semiconductor
Work experience
More than 15 years
Management
I've had experience in managing 15+ people
Skills
Languages
English
・
Professional
Job search preferences
Positions
Director or Managing Director above
Job types
Full-time
Locations
Taipei, 台灣, California, 美國, TX, 美國, AZ, 美國
Remote
Interested in working remotely
Freelance
No
Educations
School
University of Michigan
Major
Mechanical Engineering / Industrial Engineering
Sean Kuo
Director, Semiconductor Packaging R&D; Senior Member of Technical Staff
20 year experience in Semiconductor Package Development, Quality, Reliability and Assembly process improvement.
14+ year leading cross functional teams in global organization to achieve sustainable best records, improve customer satisfaction and increase stakeholder values.
Demonstrated a dynamic combination of strategic leadership and technical expertise; deep
understanding in problem-solving skill and program/supply chain/budget management; enthusiasm in people development.
Taipei City, Taiwan
[email protected]
https://www.linkedin.com/in/sean-kuo-47247a25/
工作經歷
二月 2020 - 八月 2023
Taipei, Taiwan
Director, Semiconductor Packaging R&D
Texas Instruments
- Led team to define TI-Taiwan new package roadmap and strategy, as well as develop and introduce new packages with innovative ideas, robust quality, and cost competitive solutions to on-time release.
Built strong connection with operation teams to smoothly and flawlessly launch complex devices and hit business goal.
Served as TI-Taiwan leadership team to direct and decide factory strategy as well as mitigate business continuity risks.
Organized and hosted worldwide meetings virtually with 120+ participants across 5+ time zones.
Coached engineers to win top 3 paper among 100+ papers in worldwide conference in 3 consecutive years.
Initiated and coached team to submit 36 IPs. 25 approved to file US patent.
Developed top notch people in multiple nations by leveraging worldwide resource.
十一月 2017 - 二月 2020
Taipei, Taiwan
Director, Quality and Reliability Assurance
Texas Instruments
- Led team to drive Taiwan quality strategy, build quality foundation and improve all quality indices.
Served as site customer representative to successfully pass IATF-16949 internal and external audits from key customers.
Led team to solve customer incidents and returns to receive high customer satisfaction across Assembly and Test process.
Led cross-function teams to drive site quality excellence. Reduced low tech error cases. Improved indices of 6 chronic defects to record low by engineering breakthrough.
Chair of MRB (Material Review Board) to direct risk assessment to protect quality to customers.
Chair of CCB (Change Control Board) to drive the process change risk assessment with improved quality.
十月 2013 - 十一月 2017
Taipei, Taiwan
Manager, Assembly Process Engineering
Texas Instruments
- Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
四月 2009 - 十月 2013
Taipei, Taiwan
Manager, Wire Bond and Direct Material Cost, Assembly Process Engineering
Texas Instruments
- Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
四月 2003 - 四月 2009
Taipei, Taiwan
Individual Process/Packaging Engineer, Assembly Process Engineering
Texas Instruments
- 2005 Jun to 2009 Apr (Taiwan): Senior Wire Bond Packaging Engineer
2004 May to 2005 Apr (Dallas, TX): Packaging and Si node readiness Engineer
2003 Apr to 2004 May (Taiwan): Wire Bond Process Engineer
學歷
2000 - 2002
University of Michigan
Mechanical Engineering / Industrial Engineering
Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
技能
- Word
- PowerPoint
- Excel
語言
- English — 專業
Sean Kuo
Director, Semiconductor Packaging R&D; Senior Member of Technical Staff
20 year experience in Semiconductor Package Development, Quality, Reliability and Assembly process improvement.
14+ year leading cross functional teams in global organization to achieve sustainable best records, improve customer satisfaction and increase stakeholder values.
Demonstrated a dynamic combination of strategic leadership and technical expertise; deep
understanding in problem-solving skill and program/supply chain/budget management; enthusiasm in people development.
Taipei City, Taiwan
[email protected]
https://www.linkedin.com/in/sean-kuo-47247a25/
工作經歷
二月 2020 - 八月 2023
Taipei, Taiwan
Director, Semiconductor Packaging R&D
Texas Instruments
- Led team to define TI-Taiwan new package roadmap and strategy, as well as develop and introduce new packages with innovative ideas, robust quality, and cost competitive solutions to on-time release.
Built strong connection with operation teams to smoothly and flawlessly launch complex devices and hit business goal.
Served as TI-Taiwan leadership team to direct and decide factory strategy as well as mitigate business continuity risks.
Organized and hosted worldwide meetings virtually with 120+ participants across 5+ time zones.
Coached engineers to win top 3 paper among 100+ papers in worldwide conference in 3 consecutive years.
Initiated and coached team to submit 36 IPs. 25 approved to file US patent.
Developed top notch people in multiple nations by leveraging worldwide resource.
十一月 2017 - 二月 2020
Taipei, Taiwan
Director, Quality and Reliability Assurance
Texas Instruments
- Led team to drive Taiwan quality strategy, build quality foundation and improve all quality indices.
Served as site customer representative to successfully pass IATF-16949 internal and external audits from key customers.
Led team to solve customer incidents and returns to receive high customer satisfaction across Assembly and Test process.
Led cross-function teams to drive site quality excellence. Reduced low tech error cases. Improved indices of 6 chronic defects to record low by engineering breakthrough.
Chair of MRB (Material Review Board) to direct risk assessment to protect quality to customers.
Chair of CCB (Change Control Board) to drive the process change risk assessment with improved quality.
十月 2013 - 十一月 2017
Taipei, Taiwan
Manager, Assembly Process Engineering
Texas Instruments
- Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
四月 2009 - 十月 2013
Taipei, Taiwan
Manager, Wire Bond and Direct Material Cost, Assembly Process Engineering
Texas Instruments
- Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
四月 2003 - 四月 2009
Taipei, Taiwan
Individual Process/Packaging Engineer, Assembly Process Engineering
Texas Instruments
- 2005 Jun to 2009 Apr (Taiwan): Senior Wire Bond Packaging Engineer
2004 May to 2005 Apr (Dallas, TX): Packaging and Si node readiness Engineer
2003 Apr to 2004 May (Taiwan): Wire Bond Process Engineer
學歷
2000 - 2002
University of Michigan
Mechanical Engineering / Industrial Engineering
Lorem ipsum dolor sit amet, consectetuer adipiscing elit, sed diam nonummy nibh euismod tincidunt ut laoreet dolore magna aliquam erat volutpat.
技能
- Word
- PowerPoint
- Excel
語言
- English — 專業