CakeResume Talent Search

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4-6 years
6-10 years
10-15 years
More than 15 years
Avatar of 陳柏豪.
Avatar of 陳柏豪.
Software QA Team lead @Gate.io
2023 ~ Present
Within one month
a new testing team. Provided guidance on planning from business logic documents and led efforts to ensure a comprehensive understanding of business processes. 2. Skill Development and Cross-Team Communication Mentored the team on testing techniques and fostered effective communication across different teams. Ensured a seamless integration process from development to testing to release, emphasizing the importance of minimizing frequent releases. 3. Process Integration Oversaw the entire development lifecycle, from planning based on business logic to implementation and testing before release. Emphasized a structured approach to avoid frequent releases and introduced Playwright and
Development Process
Develop New Tools
Automatic Testing
Employed
Open to opportunities
Full-time / Interested in working remotely
4-6 years
國立清華大學 National Tsing Hua University
數學 mathematics,Probability,Applied Mathematic
Avatar of 林修弘.
半導體工程師
More than one year
國立中興大學 2006年 9 月年 6 月 技能 語言能力 中文:精通 英文:精通 溝通技巧 Coaching, motivating and mentoring Public presentation and speaking Easily establishes relationships with vendors 專業技能 Data analyst Process integration Automation systems Capacity Planning 新品開發專案成果 好事多OEM三層抽取式衛生紙 運用壓花加工技術增加厚實感 五月花雪絨柔感二層抽取
Word
PowerPoint
專案管理
Open to opportunities
Full-time / Not interested in working remotely
4-6 years
國立台灣大學
生物材料
Avatar of the user.
Avatar of the user.
Past
產品開發工程師/EPM @鴻來企業股份有限公司
2018 ~ 2023
半導體工程師/PM/產品經理/專案管理
Within six months
8D/RCCA troubleshooting
Assembly Processes
EPM
Unemployed
Full-time / Interested in working remotely
4-6 years
私立中國文化大學
機械工程學
Avatar of Chun-Yi Lee.
Avatar of Chun-Yi Lee.
Technical Integration and Customer Service Senior Engineer @Hannstar
2019 ~ Present
Semiconductor Engineer
Within two months
Chun-Yi Lee, Stanley Well abilities in trouble shooting, cross functional team collaborating, schedule controlling and resource managing; possess proactive, continued learning attitude . Strong expertise in new product introduction, schedule control and design issue fixing, quality or cycle time improvement project, and domestic or oversea customer service. Email : [email protected] Phone :Work Experience • JunP resent, Technical Integration and Customer Service Senior Enginee r • Hannstar display corporation Clarified issues, cross-sectoral cooperation, provided technical solutions and supported worldwide customers for technical service on product quality. Initiated process DOE for product quality issues for Truly & Amazon
SolidWorks
Cross Functional Communications
SEM
Employed
Full-time
6-10 years
國立中正大學(National Chung Cheng University)
mechanical
Avatar of shih-heng sun.
Avatar of shih-heng sun.
Past
Process Integration Engineer @TSMC Fab12B
2019 ~ 2021
Yield Improvement Engineer
More than one year
Shih Heng Sun Semiconductor Process Integration Engineer with 5+ years of experience. TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives. Work Experiences Yield Improvement Engineer • TSMC Fab12B AugustDecember 2020 Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring
Communicating
Measuring Instruments
Semiconductor Process
Unemployed
Full-time / Interested in working remotely
4-6 years
National Taiwan University
M.S. Photonics and Optoelectronics
Avatar of Hsieh Azure.
Avatar of Hsieh Azure.
Past
R&D process integration engineer @ UMC
2014 ~ 2022
Semiconductor Engineer
More than one year
process development Process integration engineer • Taiwan Semiconductor Manufacturing Company(TSMC) JulyApril 2014 Process integration engineer from 20nm to 40nm - 55/65nm - 90nm and other mature technologies 1. Mature technology node: Customer handling (including new tape-out, low yield analysis, WAT, SPC chart) 2. Advanced technology node: 20nm process transfer from Hsinchu to Tainan, and 2P2E-DUV pitch 64nm Cu-interconnect process development EducationNational Yang Ming Chiao Tung University Electrical Engineering & IC designChang Gung University,CGU Electrical Engineering Department Personal advantage Strong learning ability Good at teamwork High problem solving ability Skills Reliability improvement Defect reduction Process Integration
Excel
reliability
Process Integration
Unemployed
Not open to opportunities
Full-time / Interested in working remotely
10-15 years
National Yang Ming Chiao Tung University
Electrical Engineering & IC design
Avatar of the user.
Avatar of the user.
資深產品工程師 @Dialog Semiconductor 德商戴樂格半導體有限公司台灣分公司
2022 ~ Present
工程師
Within one month
半導體製程相關
半導體物理
半導體材料
Employed
Full-time / Interested in working remotely
6-10 years
國立交通大學 National Chiao Tung University
電子工程
Avatar of 林庭揚.
Avatar of 林庭揚.
Process Integration Engineer @Taiwan Semiconductor Manufacturing Company
2014 ~ Present
Product Engineer
Within one year
and in the company. I hope that I have opportunity to try my best for your company with my extensive experience. Process Integration Engineer, TSMC, Tainan, Taiwan [email protected] Semiconductor (5nm~90nm) Device engineering Semiconductor Process WAT Analysis Yield Analysis Process Quality Test Manufacturing Statistical Process Control (SPC) Cp/Cpk Failure Mode and Effects Analysis (FMEA) Design of Experiments (DOE) PDCA 3-Leg-5-Why 8D Pareto Chart Box Plot & Normal Quantile Plot Failure Analysis Tool JMP software Transmission Electron Microscopy (TEM) Energy-dispersive X-ray spectroscopy (EDX) Work Experience TSMC, Process Integration Engineer
Full-time / Interested in working remotely
4-6 years
Cheng Kung University
Electrical Engineering
Avatar of 黃鈺惠.
Offline
Avatar of 黃鈺惠.
Offline
工程師 @台灣神隆股份有限公司
2021 ~ Present
工程師
More than one year
評估製程專案計劃 6.協助佈展並參展FINETECH JAPAN(日本顯示器製造技術展) 7.總攬無接縫圓筒生產線與鎳電鑄製程生產線 Process Engineer Responsibilities: - Seamless NIL technology R&D - Electroforming process control and improvement - Roll to roll production technology - Photo-resist coating process control and improvement - Plate to roller process control and improvement - Process integration Awards and Key Contributions: - Team leader - Process yield rate increase 20% - Execute process project - Improve photoresist
word
powerpoint
excel
Employed
Full-time / Interested in working remotely
4-6 years
國立成功大學
機械工程系
Avatar of the user.
Avatar of the user.
Past
Senior RD engineer @VISHAY GENERAL SEMICONDUCTOR
2018 ~ 2020
semiconductor engineer
More than one year
Analysis
Process Improvement
Device Physics
Unemployed
Not open to opportunities
Full-time / Interested in working remotely
10-15 years
Nation Cheng Kung University
Electrical Engineering

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Problem-Solving
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Adaptability
Ability to navigate unexpected situations; and keep up with shifting priorities, projects, clients, and technology.
Communication
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Time Management
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More than one year
工程師
台灣神隆股份有限公司
2021 ~ Present
台灣台南
Professional Background
Current status
Employed
Job Search Progress
Professions
Process Engineer
Fields of Employment
Work experience
4-6 years
Management
I've had experience in managing 5-10 people
Skills
word
powerpoint
excel
Creo
SolidWorks
AutoCAD
DEFORM
Moldflow
ANSYS-workbench
Languages
English
Intermediate
Job search preferences
Positions
工程師
Job types
Full-time
Locations
台灣台南
Remote
Interested in working remotely
Freelance
No
Educations
School
國立成功大學
Major
機械工程系
Print

黃鈺惠

我認為工作不僅是為公司,也是為自己,努力工作讓公司獲利,同時也是讓公司成為我的舞台,因此工作讓我持續學習,創造良性循環,也讓自己成為更有價值的人。

  Tainan City, Taiwan


工作經歷

四月 2021 - Present

工程師  台灣神隆股份有限公司

1.設備及系統操作與維護保養。
2.公用(black and clean utilities)系統管理、評估及改善。
3.設備及系統確效(DQ/IQ/OQ/PQ)文件、執行及報告。
4.異常分析調查及實施矯正預防措施。

Validation engineer
Responsibilities:
- Black and clean utilities management and improvement
- Facility, equipment and system qualifications
- GMP validation and documentation
Awards and Key Contributions:
- Optimize parameters of HVAC system
- Validate HVAC performance qualification

七月 2018 - 四月 2021

製程工程師  微采視像科技股份有限公司

奇美視像公司更名為微采視像公司
1.提升無接縫圓筒電鑄(非金屬基材)成功率
2.LIGA製程-NIL無接縫圓筒製程控制及改善
3.LIGA製程-NIL平板製程控制及改善
4.光阻塗佈製程控制及改善
5.評估製程專案計劃
6.協助佈展並參展FINETECH JAPAN(日本顯示器製造技術展)
7.總攬無接縫圓筒生產線與鎳電鑄製程生產線

Process Engineer
Responsibilities:
- Seamless NIL technology R&D
- Electroforming process control and improvement
- Roll to roll production technology
- Photo-resist coating process control and improvement
- Plate to roller process control and improvement
- Process integration
Awards and Key Contributions:
- Team leader
- Process yield rate increase 20%
- Execute process project
- Improve photoresist coating
- Production management

一月 2018 - 七月 2018

製程工程師  奇美視像科技股份有限公司

奇美材料公司的部分部門移轉至子公司奇美視像
1.LIGA製程-NIL無接縫圓筒之製程整合
2.無接縫圓筒之製程開發與改善
3.電解板凸提升工作板良率
4.開發新產品製程-無接縫圓筒電解脫模
5.評估整體生產流程

Process Engineer
Responsibilities:
- Seamless NIL technology R&D
- Electroforming process control and improvement
- Roll to roll production technology
- Photo-resist coating process control and improvement
- Process integration
Awards and Key Contributions:
- New process(Seamless NIL) scale-up
- Integrate process of fabricating seamless cylinder
- Develop electrolysis demolding process

十一月 2016 - 十二月 2017

製程工程師  奇美材料科技股份有限公司

1.電鑄製程監控與分析改善
2.最佳化製程參數及機台調整
3.LIGA製程-NIL無接縫圓筒拆模設計
4.建立電鑄液之ICP(電漿質譜儀)量測方式
5.提升無接縫圓筒拆模製程成功率
6.建立第一版無接縫圓筒拆模&電鑄標準作業流程

Process Engineer
Responsibilities:
- Seamless NIL technology R&D
- Electroforming process control and improvement
- Roll to roll production technology
Awards and Key Contributions:
- New process(Seamless NIL) developed
- Design demolding method
- Build electroforming process

學歷

2014 - 2016

國立成功大學

機械工程系

2010 - 2014

國立高雄應用科技大學

模具工程系

專案

無接縫圓筒電鑄(非金屬基材)成功率提升

無接縫圓筒電鑄(非金屬基材)的瓶頸為電鑄後導電層脫落,因此降低電阻維持電鑄穩定度

1.於小實驗槽進行實驗規劃與各項驗證

2.增加導電通道與面積,定義無接縫圓筒電鑄(非金屬基材)之電鑄方式

3.最佳化無接縫圓筒(非金屬基材)電鑄參數(電流、電壓、時間、溫度等)

最後使無接縫圓筒(非金屬基材)電鑄成功率由30%提升至90%

#產品量產導入計畫 #改善設備問題及功能提升

電解板凸提升工作板良率

工作板上的凸點為常見的缺陷

1.利用電解反應修平板凸(微米尺度)

2.透過視覺系統和電解系統進行定位與控制電流

3.優化視覺系統與電解系統增加成功率,使調整更快速、控制更精準

4.測試各種纖維材質,選定適合傳導的材料,增加電解操作性

5.建立標準化作業流程

最後常態可使原先良率70-80%的工作板提升至良率80-90%

#產品良率改善 #標準作業流程規劃

無接縫圓筒電解脫模

一般電鑄使用氧化劑在金屬表面形成氧化層,使電鑄產品後續可順利脫模

此專案則是以電解方式取代氧化劑的作用

1.測定適用的基材材質

2.最佳化無接縫圓筒電解參數

最後成功開發無接縫圓筒電解脫模

#新技術製程開發

無接縫圓筒拆模成功率提升

無接縫圓筒拆模中折板為最大瓶頸,因此由機械性質改善模具強度

電鑄製程中的參數影響陽極效率、晶格排列、沉積密度等狀況

1.最佳化無接縫圓筒電鑄參數(電流、電壓、時間、溫度、pH值、應力)

2.監控電鑄液成分與濃度,建立ICP(電漿質譜儀)量測方式

3.定義無接縫圓筒電鑄機的陽極更換方式與週期

提升模具降伏強度,拆模成功率由10%轉為70%,由實驗轉量產。

#產品量產導入計畫 #改善設備問題及功能提升

無接縫圓筒拆模設計

無接縫圓筒拆模時會遇到折版的問題,因此需考慮形變範圍來設計圓筒拆模機構

1.計算出各圓筒尺寸下的最佳適配位置

2.實際測試治具搭配位置

最後定義出圓筒拆模所適合的治具位置

#產品或零件測試驗證

Resume
Profile

黃鈺惠

我認為工作不僅是為公司,也是為自己,努力工作讓公司獲利,同時也是讓公司成為我的舞台,因此工作讓我持續學習,創造良性循環,也讓自己成為更有價值的人。

  Tainan City, Taiwan


工作經歷

四月 2021 - Present

工程師  台灣神隆股份有限公司

1.設備及系統操作與維護保養。
2.公用(black and clean utilities)系統管理、評估及改善。
3.設備及系統確效(DQ/IQ/OQ/PQ)文件、執行及報告。
4.異常分析調查及實施矯正預防措施。

Validation engineer
Responsibilities:
- Black and clean utilities management and improvement
- Facility, equipment and system qualifications
- GMP validation and documentation
Awards and Key Contributions:
- Optimize parameters of HVAC system
- Validate HVAC performance qualification

七月 2018 - 四月 2021

製程工程師  微采視像科技股份有限公司

奇美視像公司更名為微采視像公司
1.提升無接縫圓筒電鑄(非金屬基材)成功率
2.LIGA製程-NIL無接縫圓筒製程控制及改善
3.LIGA製程-NIL平板製程控制及改善
4.光阻塗佈製程控制及改善
5.評估製程專案計劃
6.協助佈展並參展FINETECH JAPAN(日本顯示器製造技術展)
7.總攬無接縫圓筒生產線與鎳電鑄製程生產線

Process Engineer
Responsibilities:
- Seamless NIL technology R&D
- Electroforming process control and improvement
- Roll to roll production technology
- Photo-resist coating process control and improvement
- Plate to roller process control and improvement
- Process integration
Awards and Key Contributions:
- Team leader
- Process yield rate increase 20%
- Execute process project
- Improve photoresist coating
- Production management

一月 2018 - 七月 2018

製程工程師  奇美視像科技股份有限公司

奇美材料公司的部分部門移轉至子公司奇美視像
1.LIGA製程-NIL無接縫圓筒之製程整合
2.無接縫圓筒之製程開發與改善
3.電解板凸提升工作板良率
4.開發新產品製程-無接縫圓筒電解脫模
5.評估整體生產流程

Process Engineer
Responsibilities:
- Seamless NIL technology R&D
- Electroforming process control and improvement
- Roll to roll production technology
- Photo-resist coating process control and improvement
- Process integration
Awards and Key Contributions:
- New process(Seamless NIL) scale-up
- Integrate process of fabricating seamless cylinder
- Develop electrolysis demolding process

十一月 2016 - 十二月 2017

製程工程師  奇美材料科技股份有限公司

1.電鑄製程監控與分析改善
2.最佳化製程參數及機台調整
3.LIGA製程-NIL無接縫圓筒拆模設計
4.建立電鑄液之ICP(電漿質譜儀)量測方式
5.提升無接縫圓筒拆模製程成功率
6.建立第一版無接縫圓筒拆模&電鑄標準作業流程

Process Engineer
Responsibilities:
- Seamless NIL technology R&D
- Electroforming process control and improvement
- Roll to roll production technology
Awards and Key Contributions:
- New process(Seamless NIL) developed
- Design demolding method
- Build electroforming process

學歷

2014 - 2016

國立成功大學

機械工程系

2010 - 2014

國立高雄應用科技大學

模具工程系

專案

無接縫圓筒電鑄(非金屬基材)成功率提升

無接縫圓筒電鑄(非金屬基材)的瓶頸為電鑄後導電層脫落,因此降低電阻維持電鑄穩定度

1.於小實驗槽進行實驗規劃與各項驗證

2.增加導電通道與面積,定義無接縫圓筒電鑄(非金屬基材)之電鑄方式

3.最佳化無接縫圓筒(非金屬基材)電鑄參數(電流、電壓、時間、溫度等)

最後使無接縫圓筒(非金屬基材)電鑄成功率由30%提升至90%

#產品量產導入計畫 #改善設備問題及功能提升

電解板凸提升工作板良率

工作板上的凸點為常見的缺陷

1.利用電解反應修平板凸(微米尺度)

2.透過視覺系統和電解系統進行定位與控制電流

3.優化視覺系統與電解系統增加成功率,使調整更快速、控制更精準

4.測試各種纖維材質,選定適合傳導的材料,增加電解操作性

5.建立標準化作業流程

最後常態可使原先良率70-80%的工作板提升至良率80-90%

#產品良率改善 #標準作業流程規劃

無接縫圓筒電解脫模

一般電鑄使用氧化劑在金屬表面形成氧化層,使電鑄產品後續可順利脫模

此專案則是以電解方式取代氧化劑的作用

1.測定適用的基材材質

2.最佳化無接縫圓筒電解參數

最後成功開發無接縫圓筒電解脫模

#新技術製程開發

無接縫圓筒拆模成功率提升

無接縫圓筒拆模中折板為最大瓶頸,因此由機械性質改善模具強度

電鑄製程中的參數影響陽極效率、晶格排列、沉積密度等狀況

1.最佳化無接縫圓筒電鑄參數(電流、電壓、時間、溫度、pH值、應力)

2.監控電鑄液成分與濃度,建立ICP(電漿質譜儀)量測方式

3.定義無接縫圓筒電鑄機的陽極更換方式與週期

提升模具降伏強度,拆模成功率由10%轉為70%,由實驗轉量產。

#產品量產導入計畫 #改善設備問題及功能提升

無接縫圓筒拆模設計

無接縫圓筒拆模時會遇到折版的問題,因此需考慮形變範圍來設計圓筒拆模機構

1.計算出各圓筒尺寸下的最佳適配位置

2.實際測試治具搭配位置

最後定義出圓筒拆模所適合的治具位置

#產品或零件測試驗證