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黃偉哲｜ Matt Huang 📱[email protected] About me ●5 years production line experience of manufacturing ●The 300 mm wafer experience for the semiconductor industry ●The knowledge of IMP/RTP/WET/Asher/Cu Plate/Vapor Etch Process Personal Skills ● Microsoft Office：Word/Excel/PowerPoint/OneNote/Outlook ● Certificate：S pecific chemical substance/Toeic 650 ●Soft：Time Management/Flexibility/Collaboration/Self-Motivated Work Experience Process Engineer 台灣美光記憶體 DecPresent Taichung, Taiwan Response for Wet Clean and Etch Process

Shih Heng Sun Semiconductor Process Integration Engineer with 5+ years of experience. TSMC PIE specializing in advanced technology semiconductor products (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield analysis, and collaborating with production line to solve problems. Making a huge leap for TSMC advanced IC fabrication in process integration and yield improvement. Enthusiastic about semiconductor product development and design which can change people's lives. Work Experiences Yield Improvement Engineer • TSMC Fab12B AugustDecember 2020 Expert in most advanced Logic IC process (5nm~10nm) and familiar with advanced measuring

Yi-Jiunn Chien, PhD An experienced technical manager with not only in-depth knowledge of semiconductor physics, process technology, device characterization and simulation, but also hands-on experience and strong problem solving skills in the semiconductor industry. Taiwan EXPERIENCE Technical Manager • United Renewable Energy Corporation DecMarch 2022 Ramped up advanced photovoltaic cell processes from the pilot phase to the mass production scale. Realized the mass production of custom-made photovoltaic modules at the subcontractor site. Took a cross-functional role to fulfill the customer's requests and the responsibility for project management, technical support, R&D collaboration

JuneMarchnm FiNFET BEoL process development, product yield improvement and device reliability improvement 1. BEoL interconnect (pitch 64nm, 2P2E-DUV) process development, yield ramp up and reliability improve. EM life time reaches 10,000 years at the 1000ppm specified customer requested 2. BEoL interconnect (pitch 52nm, SADP-DUV) process development, includes rules and test key design 3. 22nm eHV (device operating in 8V-27V) interconnect process development Process integration engineer • Taiwan Semiconductor Manufacturing Company(TSMC) JulyApril 2014 Process integration engineer from 20nm to 40nm - 55/65nm - 90nm and other mature technologies 1. Mature technology node

products). Successfully improve product yield through data analysis and DOE, and enhance process tolerance. "Teamwork" is very important to me both in the graduate school and in the company. I hope that I have opportunity to try my best for your company with my extensive experience. Process Integration Engineer, TSMC, Tainan, Taiwan [email protected] Semiconductor (5nm~90nm) Device engineering Semiconductor Process WAT Analysis Yield Analysis Process Quality Test Manufacturing Statistical Process Control (SPC) Cp/Cpk Failure Mode and Effects Analysis (FMEA) Design of Experiments (DOE) PDCA 3-Leg-5-Why 8D Pareto

 [email protected]  Linkou district, New Taipei city Tamkang University Sep– JunBachelor of Chemical and Material Engineering More than 6 years of GaAs semiconductor process experience, especially research on related applications of electron beam lithography . Participated in the development of a breakthrough process related to pHEMT, which increased the efficiency of components by 25%. Good at using Minitab, Vidas data analysis software to find out the root cause. Long-term cooperation with foreign manufacturers for electron beam lithography applications. Job Experience Senior Process Engineer • WIN Semiconductors Corp. • Feb 2015 ~ Nov 2021 Maintain

林煒智 軟體工程師 Taichung City, Taiwan As a software developer specializing in the semiconductor equipment industry, I am passionate about developing software solutions that help streamline manufacturing processes and optimize performance. With a focus on C# programming languages, I have built a diverse skill set that includes object-oriented programming, as well as expertise in a variety of communication protocols such as RS232, RS485, TCP/IP, Modbus ASCII/RTU, and Modbus TCP. In addition to my technical skills, I have a deep understanding of the semiconductor industry's equipment interface