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. *Major in charge of the first two clients ACUITY & HUBBELL in American market *Prototype optic and thermal test *Die casting mold procedure management *UL & CSA safety verification, verification Lab (GreatOne/Cerpass/BV) Schedule tracking Achievement *Designed the PC lens according with Park garage luminaries *Developed the first lamp to meet criteria of Designlights consortium Hannstar, Senior Product Strategy Mangaer , May 2015 ~ Aug 2016 *LCD automotive project management, in charge of Truly,DesaySV and BYD *New project cost effect analysis *Align with cross-functional teams communication and coordination Achievement * Developed the first big size 15.6 inch

蘇洺葳 系統分析師 • 城市，TW • [email protected] 樂於學習新技術，喜歡團隊合作及接觸團隊內不同角色定位的人，透過他們的角度去思考問題。 學歷 私立義守大學, 學士學位, 電機工程, 2004 ~ 2008 工作經歷 新雙隆生技股份有限公司, 系統分析師, 2021/9 ~ Now 主要職

pads. 5. Collaborated with Taiwan i-Bot Technology Inc. for next-generation diamond disks. 6. Collaborated with Taiwan Duratek, Inc. for next-generation diamond disks. 二、 Development and application of 3C thermal materials, significantly improving CPU performanceAchieved a 33% CPU overclock for DELL laptops, details in the appendix. 2. Collaborated with Shanghai Chengxuan New Materials Technology Co., Ltd. to develop a new thermal graphite film to replace thermal paste. 三、Assistant to international superhard materials expert, Prof. Jame Song (MITto present FIB Engineer • MA-Tek MarchOctober 2019

Tai-Cheng Hou Tainan City, Taiwan Senior CVD R&D Engineer with 6 Years of Experience. Specializing in ULK/TEOS/ALD process optimization and development. Expert in LAM and AMAT process tools. Development and mass production of dielectric in 14 nm and 22 nm technology. Embedded memory development experience. Date of Birth: 26 [email protected] Employment History RD Engineer at UMCPresent Resolved gap-fill and step height problems in embedded memory via ALD process improvement. Retrofitted the ALD process from the liquid delivery system to the new delivery system