Software Engineer, Research & Development, Project Manager
printing, Control system, Arduino, Microcontroller, LabView, Electronic and Electrical, System Identification, Artificial Neuron Network, Composite materials and piping, Machine Vision, Signal Processing, PHP . Work Experience Micron Technology 台灣美光, Test Solution Engineer, Mar 2022 ~ Present -HBM2e & HBM3 3D Packaging Test Program Development -Develop test program for HBM production automated test equipment including new test, product algorithms which covers software and hardware requirements. -Evaluate and verify yield/quality to ensure the -Provide statistical data analysis, analytics and justification on program validation and its release Micron Technology 台灣美光, APTD SILICON INTEGRATION ENGINEER, Feb 2021
Full-time / Interested in working remotely
Universiti Malaysia Perlis・
Mechatronic Engineering