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Electromagnetic Signal Integrity Engineer 電磁干擾設計工程師

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Job Description

Engineers in Electromagnetic Signal Integrity Group works with IC designers and system hardware/software engineers to guide them on electromagnetic interference issues. The candidate is expected to be proactive on the development of chip-package-PCB co-design methodologies, mmW antenna-in-package design and delivers the cost-effective PKG/PCB solutions to bring our rich mobile products to market. This position offers the opportunity to understand broad spectrum of our cellular (4G/5G) and connectivity products (GPS, BT, WiFi, FM radios) and involve in cross-functional engineering discussions on highly-integrated RFSOC/RFSIP design.

The candidate is responsible for :

  1. RF and analog signal integrity analysis and design
  2. RFSOC/RFSIP electromagnetic interference analysis and design
  3. mmW antenna-in-package design and verification
  4. Development of RF/analog chip-package-PCB co-design methodologies and validation/correlation with measurements
  5. Producing chip/PKG/PCB layout guideline

Requirements

  1. MS or above in Electrical/Communication/Electromagnetic Engineering
  2. Electromagnetic theory and it's application to RF circuit and system EMC/EMI design
  3. Familiarity with Ansys EM tools HFSS, Q3D
  4. Familiarity with ADS or Spectre-RF circuit simulator
  5. Experience in the following is a plus:
    1. Circuit design or chip/system validation for cellular (4G/5G) RF or connectivity RF such as 802.11x WLAN, GPS, Bluetooth and FM
    2. High-speed digital signal integrity (SI/PI) analysis and design
    3. mmW antenna design and verification
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3
2 years of experience required
50,000 ~ 200,000 TWD / month
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聯發科技成立於1997年,透過持續投資先進製程與前瞻技術,現已成長為全球領先的IC設計公司,提供涵蓋智慧手持裝置、智慧家庭應用、無線連結技術及物聯網產品等多個領域的系統晶片整合解决方案(SoC),並居市場領先地位。聯發科技一年約出貨15億顆晶片落實在上億台的終端產品在全球各地上市。聯發科技提供高度整合與創新性的晶片設計方案,不僅協助製造商優化供應鏈及縮短新產品開發時間,還利於其在全球成熟及發展中市場建立競爭優勢。

聯發科技致力讓科技產品更普及,因為我們相信科技能夠改善人類的生活、與世界連結,每個人都有潛力利用科技創造無限可能(Everyday Genius)。了解更多訊息,請瀏覽:www.mediatek.com.


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