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Camera 硬體設計主管／工程師
Job updated 2 months ago
Job Description
上市電子公司
- RFI /RFP/RFQ 規格確認與可行性評估
- Camera 硬體平台評估 / 設計 / 驗證與優化
- 專案試產跟進DFM/DFC、良率改善與量產協助
- 能獨立工作及跨部門協調整合
Requirements
- 了解Camera 產業與規格需求,承接過IP Camera / Doorbell 專案開發經驗尤佳
- 具ARM Platform 經驗(ex: Ambarella, Sigmastar, Qualcomm, NXP..
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About us
天群企管於2003年12月成立，至今已有二十年的中高階獵才服務經歷，擁有豐富快消品、消費性電子產品、外商精品、化妝品、金控銀行、科技業（充電樁、IOT）及MartTech等產業知識，在中高階獵頭方面已累積20年的經歷，並提供全球五百大企業中高階人才媒合及人力派遣相關服務。
Team
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Full-time
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Mid-Senior level
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2
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1.3M ~ 1.5M TWD / year
Full-time
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Mid-Senior level
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2
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1.3M ~ 1.5M TWD / year
Full-time
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Mid-Senior level
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