與潛能的最佳平台。 ▋ 實習期間及實習地點 -實習期間:2024年07月至2024年08月 -實習地點:新北市中和封測廠 ▋ 封裝工程師實習職務說明 Business Summary: SC Packaging organization creates innovative technologies that enable small package sizes, enhanced reliability, and increased performance in areas including power density, isolation, an
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