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嘉下一個令人驚豔的產品。 [工作內容] 1. 負責軟韌體之分析、設計以及程式撰寫 2. 規劃執行軟韌體架構及模組之設計，並控管設計進度 3. 進行軟韌體之測試與修改 4. 規劃、執行與維護量

1. 面對客戶解決測試與生產相關問題 2. 電腦測試系統開發 3. Android BSP ,Linux driver 開發 4. 有FAE經驗者佳 ***依據相關學歷及經歷核薪

As a Firmware Engineer summer intern, you will be involved in projects that involve: (It will be adjusted according to the final internship department.) ．Firmware Development: Assisting in the development and enhancement of firmware for various hardware devices. ．Testing and Troubleshooting: Conducting rigorous testing of firmware components to ensure stability and performance, and troubleshooting any issues that arise. ．Documentation: Creating comprehensive documentation to support firmware dev

"資訊及消費性電子事業群 專注於電源模組產品，包含筆電變壓器、PC電源供應器、工業電源解決方案、LED驅動器、PD充電器。低能耗、高效率、長壽命是光寶產品的代名詞，成為驅動世界的動力是我們

新產品韌體設計 測試並驗證韌體以符合規格要求 使用開關測試產品 不定期參加國際會議

1.新產品韌體設計 2測試並驗證韌體以符合規格要求 3.分析並除錯韌體問題 4.使用開關測試產品 5.不定期參加OIF會議，了解最新的新技術

1. 穿戴裝置 MCU 韌體開發與維護，包括Bootloader、Firmware Update與Build system 2. 具備 ARM Cortex-M4 以 C語言開發經驗。 3. BLE 開發經驗，Nordic nRF52840 尤佳。 4. 生產工廠測試韌體與Windows測試軟體開發與維護

職務說明主要職責: 1. 基於Embedded Linux Platform開發IoT相關產品(Gateway/Devices) 2. 主要有雲服務及網路通訊協定，需接觸及了解Azure IoT service/AWS IoT service 2. 熟悉Embedded Linux Kernel/Driver/Application開發 3. 有MIPS/ARM開發經驗為佳 主要

1. 產品軟體.韌體功能程式編寫/修改/測試/除錯/驗證 2. 與硬體工程師討論並驗證軟體程序之正確性 3. 配合公司新產品研發專案電路設計及程式編寫及測試驗證 4. 配合新

About the job : We are looking for talents with development enthusiasm and tenacity to join our team. Candidates must have Embedded software/firmware development and problem-solving skills, as well as good interpersonal communication and teamwork. As the scale of our team organization continues to expand, the scope of services has become wider and wider. In the future, there will be more unknown areas waiting for us to explore and dig. If you want to