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Google welcomes people with disabilities. Minimum qualifications: Bachelor's degree in Electrical, Process, or Manufacturing Engineering, or equivalent practical experience. 8 years of experience as a Manufacturing, Quality, Reliability, or Product Engineer. Experience in new site/line/equipment bring up/transfer and qualification. Experience with SMT and box build manufacturing processes, and using tools such as Valor and Allegro to perform Design For Excellence (DFx). Experience with developme

computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next area of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. We are looking for an experienced PCB Layout Engineer based in Taipei, responsible for NVI

【Summary】 透過承接或協助負責的客戶產品，逐步熟悉工程流程與製程相關知識技能，並在過程中對於原理的探究加深自身的能力，進而能從客戶的設計階段即主導DFX服務以及生產至量產的各項服

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. We are looking for an

智能產品開發，產品項包含智能音箱、各種創意智能產品、服務型機器人等，按照項目要求完成總體硬體方案設計、PCB設計、器件選型、調試、測試等等 PCB設計繪製驗證 樣機製作，樣機調試，設計驗證 產品

職責： 設計和開發數位和類比電路。 參與3C產品電路的設計。 參與電力電子產品的開發，特別是房車產業。 與研發團隊合作，滿足客戶需求並尋求創新推出新產品。 確保產品品質和性能符合行業標準

電動車電池模組機構設計與開發驗證, 如MHEV, E-BUS等電動車 機構設計 : 結構抗衝擊, 防爆, 防水, 公差分析, 散熱, 串並電池與PCBA配置 製程運用 : 塑膠射出, 板金沖壓, 鋁擠, 鋁壓鑄, 雷焊, 弧焊, 電阻焊 APQP設計規範

Develop and execute test programs utilizing the Advantest platform to ensure the quality and reliability of semiconductor products. Design load boards and manage the entire PCB manufacturing process through collaboration with external sub-contractors. Perform in-depth analysis and troubleshooting of low yield and setup failures, implementing effective solutions to improve yield rates. Regularly maintain and update test programs to align with product enhancements and technological advancements. O

Product platform HW system design integration Schematic design, PCB layout design and review RFQ/PRD research and feedback Component survey and technology study BOM creation and maintenance Circuit/system design developing , validation and debugging.

進行PCB的層層堆疊阻抗設計及SI/PI模擬分析。 撰寫版面設計指南並執行版面品質檢查。 審核並排除訊號量測問題