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【5/10 LITEON DAY- o nline briefing session】 To get more information about summer internship program>> https://forms.office.com/r/zB5DJwivdq 【Internship Positsions】Resume submissions are open until 5/16. You may apply multiple positions by links below. Hardward Engineer 硬體工程師 Softward Engineer 軟體工程師 Firmware Engineer 韌體工程師 Mechanical Engineer 機構工程師 Sales & Marketing

As a Sales & Marketing summer intern, you will be engaged in projects that involve: (It will be adjusted according to the final internship department.) ．Market Analysis: Understanding the competitive landscape and identifying market trends to inform strategic decisions. ．Product Promotion: Creating and executing marketing campaigns to promote products and increase brand awareness. ．Sales Strategy: Developing sales strategies and plans to effectively reach target customers and achieve sales goals

As a Software Engineer summer intern, you will be involved in projects that involve: (It will be adjusted according to the final internship department.) ．Software Development: Participating in the coding, testing, and debugging of new software or enhancements to existing software. ．Code Review: Engaging in code reviews with peers to ensure high-quality code standards and to learn best practices. ．Technical Problem-Solving: Troubleshooting and resolving technical issues within the software develo

As a Hardware Engineer summer intern, you will engage in projects that involve: (It will be adjusted according to the final internship department.) ．Product Development: Assisting in the design and development of new hardware products or improvements to existing ones. ．Testing and Validation: Conducting tests to validate the functionality and performance of hardware components. ．Technical Documentation: Creating and maintaining technical documentation, such as product specifications and design f

As a Firmware Engineer summer intern, you will be involved in projects that involve: (It will be adjusted according to the final internship department.) ．Firmware Development: Assisting in the development and enhancement of firmware for various hardware devices. ．Testing and Troubleshooting: Conducting rigorous testing of firmware components to ensure stability and performance, and troubleshooting any issues that arise. ．Documentation: Creating comprehensive documentation to support firmware dev

As a Mechanical Engineer summer intern, you will be involved in projects that involve: (It will be adjusted according to the final internship department.) ．Design and Analysis: Assisting in the design and analysis of mechanical components and systems to ensure functionality and efficiency. ．Prototyping and Testing: Creating prototypes and conducting tests to evaluate the performance of mechanical designs. ．Documentation: Preparing detailed documentation, including design specifications, manufact

式的發展史」；加入TI，你有機會與全世界的菁英互動，TI更是你展現獨特智慧與潛能的最佳平台。 ▋ 實習期間及實習地點 -實習期間：2024年07月至2024年08月 -實習地點：新北市中和封測廠 Responsibilities include: · Evaluate, select, and order

更是你展現獨特智慧與潛能的最佳平台。 ▋實習期間及實習地點 • 實習期間：2024年07月至2024年08月 • 實習地點：新北市中和封測廠或台北市松山業務辦公室 ▋Job Description: TI has a dynamic two-month internship for undergraduate and graduate students looking for exciting

加入TI，你有機會與全世界的菁英互動，TI更是你展現獨特智慧與潛能的最佳平台。 ▋ 實習期間及實習地點 -實習期間：2024年07月至2024年08月 -實習地點：新北市中和封測廠 ▋ 製程工程師實習職務說

TI更是你展現獨特智慧與潛能的最佳平台。 【實習期間及實習地點】 -實習期間：2024年07月至2024年08月 -實習地點：新北市中和區興南路一段142號 OR 新北市中和區中正路866號 【產品測試工程師實習職務