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Chung Yi Tsai
Section supervisor
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Chung Yi Tsai

Section supervisor
Hello My name is Cai Chung-Yi. You can just call me by my English name, Terry. I am 37 years old.There are 4 people in my family, including my wife and two children and me. I graduated from Formosa university. I have ten years engineering experience. I was section manager in Cather I know how to project management and research.
Catcher Technology(China Suqian)
National Formosa University
Taichung, 北區台中市台灣

Professional Background

  • Current status
    Unemployed
    Not open to opportunities
  • Profession
    Mechanism Engineering
  • Fields
    Consumer Electronics
  • Work experience
    10-15 years (6-10 years relevant)
  • Management
    I've had experience in managing 15+ people
  • Skills
    Research
    Injection Molding
    Project Management
    Heat Treatment
    SolidWorks
    CNC Manufacturing
    ProE
  • Languages
    English
    Intermediate
  • Highest level of education
    Bachelor

Job search preferences

  • Desired job type
    Full-time
    Not interested in working remotely
  • Desired positions
    Manager
  • Desired work locations
    China
    Taichung, North District, Taichung City, Taiwan
  • Freelance
    Non-freelancer

Work Experience

RD Section supervisor

Aug 2013 - May 2020
6 yrs 10 mos
a.Process skill 1.Design Extrusion part and define factor. 2.CNC Mills, Stamping , 3.Surface : Polishing , Sand blasting with robot 4.Assembly process: laser ,painting ,gluing. b.Co-work with MDE 1.Design production fixture and gauge. Co-work with MDE. 2.Run DOE to find the best factor and condition. 3.Die casting, forging Production : Project Leader *Housing(A part) : Mac Air 13" / New Mac Pro 16"/Mac Pro 13" *iPod * Apple Stainless logo.

Senior engineer

Aug 2012 - Aug 2013
1 yr 1 mo
1. Project management. 2.Design home appliance and drawing 2/3D structure. 3.Inert molding and die casting. 4.Mockup. 5.ORT test. Production : grill / coffee machine

Equipment engineer

Oct 2007 - May 2011
3 yrs 8 mos
1. Wafer Grind, Die Sawing,Die Bond 2.Equipment repair and maintenance Production : IC chip

Education

Bachelor’s Degree
Mechanical engineering
2004 - 2006
Associate’s Degree
Mold and die technology
1998 - 2004