1.Release new CP/ FT device on Subcon & OSAT 2.Production issues analysis and summarize report 3.Wafer Sort/Final Test suppliers and drive operation performance 4.Product yield enhanced and improvement summarize report. 5.Subcon & OSAT production process audit and review 6.Multimedia production test engineering team leader. 7.Tester platform:Teradyne J750,UltraFlex,IFlex 8.Prober platform:TSK,TEL 9.Handler platform:EPSON 10.Hold lot disposition and EQC issue verifi cation 11.ATE Load board/probe card troubleshooting and maintenance

1.Assist the customer to input new products and improve the yield performance 2.Establish production process 3.Handling hold lot and analysis 4.low yield improvement, troubleshooting of related production equipment 5.Analysis of product site yield gap 6.Analyze the program with channel diagram, pin diagram and data log or alarm message to verify the test board debugging 7.Assist customers to verify the new version of the test program and OI interface 8.Product yield control and abnormal integration and analysis of worldwide customers side production. 9.Assist in verify the electrical test abnormal IC. 10.ATE platform : 11.Teradyne : Eagle 12.Prober platform: TSK,TEL 13.Handler platform: EPSON

1.Use Teradyne ATE, UFLEX,IFLEX platform to maintain production loadboard for customers. 2.Waveform,shmoo plot,TDE tool for program debugging and maintenance of customer's loadboard 3.Assist customers to NPI and improve yield 4.Assist customers to verify new test program and OI interface 5.Assist clients in the transformation of loaodboard layout 6.Product yield control and abnormal integration and analysis of products 7.Assist in verifying client electrical test abnormal IC 8.ATE site difference reading value analysis 9.Adjust test parameters, voltage, current, delaytime, etc.,to improve product yield 10.Analyze program with channel map, pin map and datalog or alarm messages for verifi cation test board debug 11.Verify and test socket probe lifetime maintenance 12.Adjust needle clearing parameters of prober(TSK and TEL) to improve product yield 13.Reduce production test time and improve effi ciency 14.Establish OCAP to bring up and training shift Engineer skills