Aug 2020 - Present
• N5 mass production owner by WAT analysis, find out the potential electrical abnormality.
• Device (RO%) boost by Speed/Iddq/Vts/Isat/DIBL/LC/SC/Sws tracking analysis.
• Customer handling, ex: HPC Project/ S2S/ Wafer uniformity improvement (IDU/VtU/SPU).
• Yield analysis (Mbist/ LVccmin/ IDS/ Repair/ Chain scan) to develop the yield loss spec.
• SPICE model setting/ Corner skew methodology (FF/SS/FS/SF).
• Reliability (RA) improvement (HTOL/ TDDB) BKM check with QR team.