你好，我是林誠恩，從事封裝設計至今6年，主要負責multi chip module, package on package, embedded die package 相關設計。 在本司前兩年主要承接以上設計業務，由於在前公司有光罩設計的經驗，僅半年的時間我已為客戶溝通主要窗口之一，並協助客戶檢查及設計。 近半年中，協助公司導入Calibre相關作業，並學習驗證用程式語言，使原本繁雜的檢測作業時間減少50%以上。 曾與IC設計公司合作完成完成驗證用 module 如 ：daisy chain design 撰寫Calibre drc程式，協助其他公司設計module時的檢查及除錯。 能夠與外國客戶溝通與解決設計問題。 熟悉Cadence apd, Calibre 驗證程式, Klayout, AutoCad, Cam350 。 Name: Cheng-En Lin Professional Summary: With 6 years of experience in packaging design, I specialize in multi-chip module, package on package, and embedded die package design. I have experience in communicating with clients and providing design solutions in a timely and efficient manner. Experience: Designed and managed multi-chip module, package on package, and embedded die package projects for the past 6 years Worked as a key communication window for clients within 6 months of starting at my previous company Assisted in the implementation of Calibre-related tasks, resulting in a 50% reduction in detection time Collaborated with IC design companies on verification module design, such as daisy chain design Wrote Calibre DRC programs to aid other companies in module design inspections and debugging Able to communicate with foreign clients and solve design problems Proficient in Cadence APD, Calibre verification programs, Klayout, AutoCAD, and Cam350 Possess strong teamwork skills, able to coordinate and collaborate across departments to complete tasks Personal interests include fitness, hiking, and running a half marathon Education and Skills: Bachelor of Science in Electrical Engineering, National Formosa University Fluent in Mandarin and proficient in English

負責WLCSP,Flip chip 之bumping 光罩設計。