1. Mobile phone modem digital development management (ko to mp) 2. TSMC Process 3nm, 4nm 3. RMA Analysis management 4. Design Flow and tool control 5. Chatgpt+python/Matlab improve efficency

1. CMOS sensor 架構規劃 2. 數位架構規劃 3. IP討論 4. 省電規劃 5. low power I2C, SPI Slave 6. auto register bank, new sensor timing generate, SRAM buffer, ADC offset cancellation, IC test mode for CP&FT, async FIFO , DSP for moving vector detect, digital gain, sensor pixel addressing method, WROI, auto exposure control. 7. digital Team setup 8. color detect, TOF, distance detect, ALS, PS, eye tracking, finger detect,....for low power sensor meta application Future Product: 三角測距，iTOF，dTOF，電競Mouser 財務緊縮，部門解編。

產品： ISP+AI DLA晶片 1. AI加速器maintain and modify 2. 評估新一代架構可行性 3. CONV/RELU/BIAS/POOLING TSMC 28nm,

SOC 數位IC設計 1. HDR 2. MEMC MV/FB 修正broken improve，演算法實現 3. DSC C MODEL & IP Maintain 4. OSD +GDMA+SCALAR 5. MEMC FPGA整合 VIVADO FPGA IP EDA （CDC, SYN, LEC, STA, PTPX, DFT） TSMC 28/22/12nm process

1. TFT driver tcon+sourec 2. MIPI,LVDS,mLVDS,PDI(PHI)interface 3. I2C,SPI interface 4. system ESD improve use digital filter 5. CABC/CE/SLR/sharpness color processing 6. digital team re-build & lead 10 members 7. HD/Full HD resolution 8. CASCADE IC architecture 9. High Speed IO RX Decoder 10. lead digital team MP from 100K/M to 1KK/M(4.5 years）

1. Set/Lead digital team 2. Mobile TFT Driver IC Integrated chip 3. digital gamma algorithm & FRC function define 4. WVGA ramless project plan 5. GIP/GOA flexible function specification define 6. MIPI DSI maintain. 7. Digital class D algorithm and implement

• Design Flow for 6502/1T 8051 embedded system. • Design Flow for ARM or Cortex embedded system. • Integration for ASIC or SOC IC using EDA tool. • Project Leader • Mass Production Support for CP/FT design • Support PM for Customer Specification Discussion.

1. 12T 8051 circuit level, cosim 2. 4T turbo 8051 rtl sim 3. RF SPI Interface design 4. local sim and vetify