⚫ Expertly trained on the 901x series in R&D product lines for dry etching process. ✓ Now being responsible for N3 MEOL process. ⚫ Customer’s information data collection and analysis, solve process issue and optimize process to get process POR. ✓ Cooperating with customer to analysis abnormal data then improve etching rate/particle and inline stability. ⚫ Process CIP evaluation and implant in customer site to improve process stability. ✓ Clean recipe optimization for Al particle reduction to prolong MTBC of chamber. ✓ ESC voltage optimization to improve surface particle/backside particle. ⚫ Communicate between Japanese resource and customer sites and provide effective solution toward dry etching process. ✓ For inline idle effect, we collected on-site data and discussed with Japanese site to design experiment, then provided the model and solution to solve this issue. ✓ Clean efficiency improvement for Al particle by discussing and testing recipe parameter to get the optimized one.

⚫ Being responsible for medium current and high energy ion implanter ⚫ Conducted assessing processes, taking measurements and interpreting data. ⚫ Maintained SPC chart and performed risk assessment. ⚫ Developed best practices, routines and innovative solutions to improve production rates and quality of output. ✓ Arcing defect improvement by adjust suppression voltage for low - energy and high dosage implant process. ✓ Beam standard improvement by set beam spectrum analyzer for high-energy implantation, decrease 200pcs WAT abnormal/1year ✓ Medium current idle time defense function to avoid WAT shift by beam-decay case. ✓ Set RTM to catch chamber pressure when beam profile scan to avoid beam profile error caused by chamber leakage. ✓ Create a new particle monitor procedure instead of scratch monitor to improve cycle time. ⚫ Solved urgent conditions for production line.

⚫ Being responsible for N28 etching from spacer to ESD layer. ⚫ Planned and executed effective, well-designed experiments ✓ Planned over etch split for yield loss case on salicide layer and solve the weakness of process window. ⚫ Co-work with vendor for New tool release for cycle time improvement 9 tool/year. ⚫ Maintained SPC chart and performed risk assessment. ⚫ Defect source analysis, co-work with equipment engineer to improvement particle performance.