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My major is the development and integration of motherboard hardware, power bank with QI, QC, PD design, PCB layout, ODM project, smarting light product system planning, and can independently produce schematic, PCBlayout, bom list, etc., understand RF Module routing features, matching, etc. Have contacted DC to DC buck, microwave motion sensor design and debug.
Production of product specifications, material price evaluation forms, schematic, layout, Gerber, board factory parts (AOI), EVT, DVT, PVT, mass production, production technology transfer SOP, Test report, etc. OEM, ODM Motherboard (CFL-S B360chipset, CML-S B460chipset), SSD2.5 @ # 11 # @ SATA, SSD M.2 (PCIe4.0 and SATA), UDIMM2400 / 2666, SODIMM2400 / 2666, LCD monitor manufacturing project , Powerbank

在電子系學會期間舉辦過迎新宿營、系所特色活動、中小學學習營、電路焊接競賽、三分球大賽等大大小小活動。

St. John's University

R&D硬體工程師  @ 勤力合實業股份有限公司

Archieyou

勤力合實業股份有限公司

R&D硬體工程師 

開案後評估產品規格、用料、schematic、layout、Gerber、板廠打件（AOI)、EVT、DVT、PVT、量產，製作規格書、技轉SOP、Test report等等。OEM、ODM Motherboard(CFL-S B360chipset、CML-S B460chipset)、SSD2.5”SATA、SSD M.2(PCIe4.0 and SATA)、UDIMM2400/2666、SODIMM2400/2666、LCD monitor manufacturing project、powerbank

RF matching、EVM、Sensitivity、EMI.
PCB schematic & layout design.
Do something that include product engineers.
PCB port：製作原理圖、layout圖、gerber、NcDrill、bom list、EMI
RF port：matching、sensitivity、EVM、RSSI
PE port:新產品測試、協助客戶排除產品上的問題、協助產品導出測試及測試整合、協助RD和Software處理Hardware問題等

達盛電子股份有限公司

RF硬體工程師 

各種新聞類別報導之外場採訪與現場連線,使用衛星訊號連接方式進行LIVE連線,影像剪接、聲音處理、外場導播等工作內容。

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