Lead Foundry and OSAT, Assembly for WLCSP (Wafer Level Chip Scale Package) and TSV (Through Silicon Via) yield projects, accounts for estimated 100 Million US of selling price in 2021. • Lead Foundry (CN/JP), OSAT (Out-sourcing assembly and test) yield activities projects. • Lead all WLCSP/TSV/Flip chip yield activities projects. • Work with OSAT to propose and provide technical/Quality and cost saving solutions & on-time issue monitoring. • Team representative and liaison to peer & corp. yield management team • Part of new product feasibility process setup team. • In process control (stability), process capability best practice cross fertilization management. • Promoting yield improvement and systematically feedback information to new product development team, PDCA cycle review. • Actively identify scrap saving opportunities. • Process optimization related to yield loss caused by strict customer requirements and quality case. • Be yield enhancement hub for technical assessment from IC circuit design, wafer manufacturing, assembly, test and OSAT capability evaluation. • Initiate taskforces to drive OSAT on multi-dimensional tasks including customer voice, quality focus, production sustaining. • Lead continuous improvement program to achieve excellent yield and quality performance. • Drive yield improvement and analysis the reason of high scrap in OSAT. • Conduct technical communication with OSAT on roadmap to ensure the compliance of potential tightened inspection criteria from end customers. • Regularly develop and implement the supplier strategies, through analysis of various yield indicators, i.e. scrap$saved trend. • Lead leakage issue and Open short Taskforce OSAT for testing failure cross-fertilization in worldwide OSAT, scrap$saved 100M US in 2021. • Lead chipping taskforce OSAT for customer complaint cross-fertilization in worldwide OSAT, scrap$saved scrap$ saving 50M US in 2021.

Directed the daily operations of one full-time engineer, Directed all aspects of all OSAT operation projects, from technical to high volume manufacturing. ♦ Lead all OSAT (Assembly and Test) activities projects. ♦ Manage all WLCSP/TSV/ Ball Grid Array(BGA)/Lead frame (LF) operation activities in OSAT to ensure all risks are monitored. ♦ Manage all Test operation activities in ISAT to ensure all risks are monitored. ♦ Primary interface between ST Division team and worldwide OSAT to ensure time resolution to production technical issues in customer and OSAT. ♦ Drive yield improvement and analysis the reason of high scrap in OSAT ♦ Review and manage PCN from initiation, qualification, low-volume monitoring to deployment. ♦ Responsible for Technical assessment on new OSAT ♦ Interface with end customer for quality audit and complaint in OSAT ♦ Regularly develop and implement the supplier strategies, through analysis of provided processes, products and services. ♦ Lead 2nd source qualification

Directed the daily operations of two full-time engineer, provides management for supplier chain technical and quality program management including the foundry, assembly, testing and module house of IC. Support manufacturing planning performance management. Ensures all sub-con processes are in accordance with company standards and all relevant regulations. Analyzed current processes before determining the most effective strategies which would ultimately result in cost reductions for the company while assessing yield enhancement and reliability stressing. ♦ Lead all OSAT (Assembly and Testing) activities projects. ♦ Manage all WLCSP/Ball Grid Array(BGA)/Lead frame (LF)/System in Package(SiP) operation activities in OSAT to ensure all risks are monitored. ♦ Directed the supply chain management including the acquirement and inspection and assembly materials, PCB, substrate, BOM materials and the overseeing of machine subcontractors. ♦ Developed the Cu wire bonding in subcontractors ♦ Leveraged prior experience to successfully manage all aspects of the supply chain as well as quality control for all materials. ♦ Implemented new strategies which successfully raised savings and cut costs by selecting the most effective materials with the best cost ratio. ♦ Facilitated the supply chain process including assembly material selection and the direction of machine subcontractors.

Directed the daily operations of six full-time employees while establishing long term goals. Facilitated the IC package and SMT process by surveying, selecting, and designing mechanical structures. Performed supplier chain management functions, including tasks involving assembly materials, Program management the BOM, NPI ramp up, quality resolving and customer complaint. ♦ Lead all Ball Grid Array(BGA)/Lead frame (LF)/System in Package(SiP) assembly, SMT activities projects. ♦ Directed the supply chain management including the acquirement and inspection and assembly materials, PCB, substrate, BOM materials and the overseeing of machine subcontractors. ♦ Produced the most valued patent consecutively for two years. ♦ Played a key role in the construction of the Cu pillar bump assembly line from including determining process flow, performing machine surveys, plant layout, the CU pillar material survey, and cost analysis. ♦ Handled key accounts including TSB, Micron, IBM, Sharp, and Intel. ♦ Manage lead-frame/Substrate/PCB suppliers. ♦ Conduct periodical line audit in supplier, lead-frame supplier (SDI) and substrate suppliers (Unimicron) to confirm supplier’s quality management level and ensure audit actions are appropriate and have been put into practice. ♦ Conduct on-site validation to figure out root cause of quality issues at supplier. Successfully qualified new supplier (Nanya) to prevent line down issue at Unimicron.

Directed the daily operations of one full-time engineer, performed in-depth surveys of Driver IC assembly mechanical structures and materials before selecting the appropriate candidates to move forward with mass production. Spec. define and new program consultant with IC assembly, test and module house. Performed in-depth surveys and development of polymer particle for core-shell structure, which is particularly suitable for biomedical applications such as MRI (magnetic resonance imaging) developer, specific tissue identification developer, and magnetic thermal therapy. ♦ Lead all drive IC assembly, SMT activities projects. ♦ Directed the supply chain management including the acquirement and inspection and assembly materials, PCB, substrate, BOM materials and the overseeing of machine subcontractors. ♦ Awarded with the ITRI Excellence Research for a NCF-type Compliant-bump COG in real display panel. ♦ Performed semiconductor polymer materials feasibility studies prior to selection. ♦ Awarded two Patent for metallization polymer particle for MRI applications.