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奸克勞德
Manager
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ATX Semiconductors Suzhou
國立臺灣海洋大學 National Taiwan Ocean University
Kaohsiung City, 台灣
Featured Resume
Last updated on Feb 4th 2024
Professional Background
- Current statusUnemployed・Ready to interview
- ProfessionProduct Engineer・Project Engineer
- FieldsSemiconductor
- Work experienceMore than 15 years (More than 15 years relevant)
- ManagementI've had experience in managing 1-5 people
- Skills
- LanguagesEnglish・FluentChinese・Native or Bilingual
- Highest level of educationMaster
Job search preferences
- Desired job typeFull-time・Interested in working remotely
- Desired positionsProject Manager
- Desired work locationsKaohsiung City, Taiwan・Tainan City, Taiwan・Taiwan・Japan
- FreelanceNon-freelancer
Work Experience
Project Manager
Suzhou, Jiangsu, China
1. Took charge of NPI leader of N company (Analog, Logic & Cu-clip devices) products from Apr’23 to Nov’23. Also took charge of NPI of B company (MEMS device) at the same period.
2. Took charge of NPI leader of N company (Isolator & MEMS devices) products from Jul’22 to Apr’23
Business Manager
Suzhou, Jiangsu, China
1. Took charge of business development of US customers (main focus on T & S companies) from 2018 to 2022
2. Led revenue of US account with 200% growth from 2018 to 2021
Project Manager
Suzhou, Jiangsu, China
1. Took charge of New device phase-in of E company (Diversity front-end module) products from Nov’15 to Aug’18
2. Took charge of New device phase-in of T company QFN products from Nov’15 to Aug’18
Project Engineer
Kaohsiung City, Taiwan
1. Took charge of New device phase-in and HVM issue of Module products (Wireless/PA/Wearable module) from Dec’12 to Nov’15
2. Took charge of New Products development of Stacked-Die FBGA and PoP (package on package) products from Y2008 to end of Y2012
3. Successfully led FOW (DAF over wire) products of M company into mass-production in end of Y2009
4. Successfully led PoP products of B company into mass-production on Q2 of Y2011
Integration Engineer
Tainan City, Taiwan
Took charge of F/BEoL integration includes 45nm wafer processing, Flip-chip/BOAC rule maintain and low-k wafer dicing solution.
Product Engineer
Kaohsiung City, Taiwan
1. Took charge of New Products Development of Stacked-Die FBGA.
2. Successfully led MSPD (Memory Stick Pro Duo) products of S company into mass- production in end of Y2005.
3. Successfully pass qualification lots of Stacked-die FBGA of I company in Jan’07 and start mass-production on Q2’07.
Process Engineer
Kaohsiung City, Taiwan
Took charge of troubleshooting and process integration of Front End Processes (Wafer preparation to Die attach) of FBGA
Education
Master of Science (MS)
・
Materials ScienceDescription
Thesis: Study on Plasma Vitrification Treatment for Petroleum Industry Wastes and LLRW Surrogates from Nuclear Power Plants
Bachelor of Engineering (BEng)
・
Materials Science