EXPERIENCE ➢ 2010/10 --2019/3: NXP Semiconductors | Manufacturing Test Engineer ➢ New product test correlation and test program release (Platform: Micro FLEX) ➢ RF Load board duplication and characterization (Platform: Micro FLEX) ➢ Implement: Yield | Test stability and efficiency | SOP for production control (Platform: Micro FLEX) ➢ Accountable for troubleshooting, low yield improvement and RF load board repair ➢ Devices: Band transceiver | Transmitter IQ modulator | LNA ➢ Auto correlation to reduce RF power offset between different tester (Platform: Micro FLEX) ➢ Analysis of testing results for production improvement (Platform: Micro FLEX)