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王亦翰
Deputy Section Manager
Since the beginning of work in 2013/9 to present with 10.5 years experience as an engineer.
With 7.5-years experiences as engineer in Semiconductor Industry, mainly focus on yield improvement, process technical, new product evaluation, and handle customer complaint investigation.
Familiar with customer service and application experience in the field of semiconductor chemicals for wet-etching and lithography processes.
Good at support main client TSMC with EUV, KrF photoresist and advanced semiconductor packaging industry client (OSAT) SPIL, PTI, Chipbond and ChipMos for bumping process with etchant and stripper maintenance and troubleshooting.
Experience with schedule planning/ man-power allocation/ cost control & saving.
Familiar with cross-function communication with members.
添鴻科技股份有限公司
國立雲林科技大學 National Yunlin University of Science and Technology
Hsinchu, 新竹市台灣
Professional Background
- Current statusUnemployed・Ready to interview
- ProfessionProcess Engineer・FAE Engineer・Materials Engineer
- FieldsSemiconductor
- Work experience6-10 years (6-10 years relevant)
- ManagementI've had experience in managing 1-5 people
- Skills
- LanguagesEnglish・Intermediate
- Highest level of educationMaster
Job search preferences
- Desired job typeFull-time・Interested in working remotely
- Desired positions半導體製程工程師,半導體製程整合工程師,半導體研發工程師
- Desired work locationsHsinchu, Hsinchu City, Taiwan・Hsinchu County, Taiwan
- FreelanceNon-freelancer
Work Experience
資深應用工程師
Job responsibility:
1.Experience with support advanced semiconductor packaging industry customer such asSPIL, PTI, Chipbond and ChipMos with
evaluate new product and provide application support
.
2.Maintain and develop good relationships with customer during troubleshooting. Workclosely with customer to understand issues and demands.
3.Interface with R&D team and customer to develop new product.
4.Design and complete DOE (Design of Experiments) evaluations material for customer.
5.Responsible for customer complaint.
品質分析應用工程師
Job responsibility:
1.Experience with support main client TSMC with EUV equipment, measuring product, on-site
inspection as required.
2.Interface with MFG and QA teams to support production running smoothly.
3.Manage the photoresist product speciation and planning measurement schedule.
4.Analyze data and provides adjustment parameters for the next stage.
5.Responsible for customer complaint, tool recipe setup and test.
6.Inspect sample by TEL Clean track, ASML scanner, KLA SP2, CD-SEM.
7.Inspect EUVR, KrF, Polymer, item: Film thickness, CD-size, Defect.
Achievements:
1.EUVR Development recipe improvement 20%*2 products
2.KrF Coater recipe improvement 20%*2 products
3.Wafer cost down 600,000 NTD/year
4.Tool APM cost down 30,000 NTD/year
5.Publish PM SOP*3
產品工程師
1.Experience with customer complaint and analyze abnormal sample from customer.
2.Familiar with cross departmental working and communication.
3.Good at revise process follow file.
製程整合工程師
1.Familiar with evaluate new product and new process technology.
2.Produce special request sample from customer.
3.Experience with setting new spec for new product and Investigate customer complain.
Achievements:
1. Evaluate new product and mass production *30item
2. Evaluate new process technology: New wet etch recipe
3. Produce special request sample of customer *20item
4. MES setting for new product *450item
5. Inspect tool reform, parts cost down 1,280,000NTD/per year, and save cost of produce 130,000,000 NTD
Education
Master of Science (MS)
・
材料科技研究所
Bachelor of Engineering (BEng)
・
光機電與材料學士學位學程