1. Chip product development from 2010 to now. 2. R&D service contact window for key accounts since 2012. 3. Project management for worldwide customers, including sample providing, DQA procedure, qual. plan setup/report, technology roadmap presenting...etc. 4. Lead a team of 17 members, and cooperate with whole PKG/LB PD team in LEX for new product development. The business includes conventional PLCC for lighting & backlight unit, molding type LED for automobile appl., and CSP(chip scale package) for cost effective backlight appl as well. 5. MiniLED proJect leader, in charge of chip design & widen emitting angle technology development.

1. BEOL process engineer. 2. Familiar in laser scribing and AOI instruments. 3. 20% cost down achievement in 2009-2010.