A curious and active person with a degree in Physics from Tamkang University. I am responsible and good at cooperating with others. When encountering difficulties, I will find ways to solve the problem with logical thinking. Actively pursuing an employment opportunity.
1. Used an X-Ray instrument to check the percent of void in solder balls of wafers.
2. Operated SAT to scan the delamination in wafers.
3. Employed 3D Optical Microscope to observe the appearance of wafers.