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5G Elite Trainee in Market Area North East Asia (MNEA) at Ericsson Group, based in Taipei, Taiwan. Former International Scholar at KU Leuven who focused on advanced electronic packaging technology, which is commonly used in IC and ICT industries. Moreover, I have served as an R&D Intern at imec, Belgium, a HW Intern at Qualcomm, and a Graduate Research Assistant at TSMC research center in NCTU, Taiwan.

One-year full sponsorship by KU Leuven and imec.

Katholieke Universiteit Leuven

• Research Field: 3D heterogeneous integration, Low-temperature Cu-to-Cu bonding, Thermal simulation of 3D IC
• Core Courses: Semiconductor Process, Semiconductor Physics, and Devices, Theory and Modeling of Semiconductor Nanostructures, Reliability and Failure Physics of Semiconductor Devices, Material Analysis, 3D Integrated Circuit.
• Under the supervision of Prof. Kuan-Neng Chen, collaborating with Taiwan Semiconductor Research Institute (TSRI), Industrial Technology Research Institute (ITRI), UC Berkeley, and Center for Semiconductor Technology Research in NCTU.
• Master Thesis: Process Development and Simulation Analysis for Lowering Thermal Budget on Stacking/Monolithic 3D Integrated Circuits.

National Chiao Tung University

National Tsing Hua University

Northeast Asia 5G Management Trainee at Ericsson Group

Pin-Jun Chen

Ericsson

Northeast Asia 5G Management Trainee

5G Elite Trainee Program in North East Asia
• Under the coaching of the President of Ericsson Taiwan, Chafic Nassif.
• Be rotated in three core departments of Project Management, Product Management, and Sales within two years.
• Support the key account management (KAM) team with product and solution expertise focusing on 5G projects.

Wafer Bonding Assembly Team
• Designed and conducted a novel process to fabricate 3D microfluidic devices with dry film resistance (DFR) technology.
• Manipulated laminator, bonder, and SAM to investigate the optimal parameter for the DFR process.  


Interuniversity Microelectronics Centre (imec)

Research and Development Intern

Reliability Engineering Team
• Learn the product level reliability evaluation for leading-edge silicon process technology on mobile products. 
• Learn how to use statistical analysis (Weibull, Lognormal), reliability tools or software, HTOL oven, and ESD machine. 


Qualcomm

Hardware Engineering Intern

TSMC Research Center in NCTU (交大－台積電聯合研發中心)
• Under the supervision of Prof. Chenming Hu, former CTO of TSMC, from UC Berkeley.
• Collaborated with TSRI and NCTU-UCB Joint Center for Intelligent Semiconductor Technology to develop a novel process for next-generation Monolithic 3D BEOL FinFET.

Taiwan Semiconductor Manufacturing Company (TSMC)

Graduate Research Assistant

Electronics and Optoelectronic System Research Laboratories
• Used different materials as passivation layers to investigate low-temperature Cu-to-Cu bonding technique.
• Utilized ANSYS APDL to analyze transient thermal conduction problem in different models and boundary conditions.


Industrial Technology Research Institute (ITRI)

Research Intern

Department of Chemistry
• Research topic: Synthesis of Sonogashira Cross-Coupling Reaction. 
• Used Pd catalyst to synthesize over 20+ types of compounds to investigate the Sonogashira coupling mechanism.


The Chinese University of Hong Kong (CUHK)

Undergraduate Research Assistant

Institute of Chemistry
• Research topic: The Conductivity Shift of PEDOT Derivatives.
• Used four-point probe measurement and Autolab to analyze the conductivity for 10+ kinds of conducting polymer.


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