I join TMBS Schottky Diode team in Vishay Corp. It is 6 inch wafer foundry house and has assembly line. I implement process improvement and new product develop within difference package type.

I join BCD & Trench MOSFET team in World Vanguard International Semiconductor Corp. It is 8 inch wafer foundry house. I implement items. 1. I supported new customer design in new products when new production has DRC fail suggestion 2.Support customer request device co-work with PDK team, verify by shuttle mask. 3.Co-work Product team for mass products yield loss process improvement.