1. 14nm/22nm/28nm/40nm/MRAM/HEMT TSK tapeout 2. TSK design and operation 3. WAT analysis 4. Power GaN and RF(radio frequency) GaN application technology development Tapeout preparation] — TSK design for process monitor or issue — Layout operation ability, ex: klayout, laker, UDD(user define device) — DRC and LVS check for layout QA — Boolean editor and operation trial run Integration] — Process flow setup and lot handling — Coworker with WTK(Wavetech), Vendors(Unikorn,Episil) and module(ET,LT,TF,DF,FA,device team) — DOE(Design of experiment) implement — Loop owner to solve process issue and optimize BKM(Best known method) [Analysis methodology — device characteristic analysis(HEMT, MOSFET and MRAM) — WAT data analysis and FT yield analysis