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李柏逸
韌體工程師 @ 新加坡商兆普科技
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李柏逸

韌體工程師 @ 新加坡商兆普科技
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新加坡商兆普科技
台北大學

Professional Background

  • Current status
    Employed
  • Profession
    Software Engineer
    Firmware Engineering
  • Fields
    Software
    Hardware
  • Work experience
    1-2 years (1-2 years relevant)
  • Management
    I've had experience in managing 1-5 people
  • Skills
    C
    MCU
    DSP
  • Languages
    English
    Intermediate
    Chinese
    Native or Bilingual
  • Highest level of education
    Master

Job search preferences

  • Desired job type
    Full-time
    Interested in working remotely
  • Desired positions
    軟韌體工程師
  • Desired work locations
    Hsinchu, Hsinchu City, Taiwan
  • Freelance
    Non-freelancer

Work Experience

韌體工程師

May 2022 - Present
ti c2000 dsp 韌體開發 數位電源研發
Logo of the organization.

車載系統應用開發工程師

明泰科技
Internship
Feb 2018 - Jun 2018
5 mos
負責車載系統周邊應用開發: 2D/3D環景影像拼接、人臉辨識、影像物件偵測。 使用技能: Python / C / OpenCV /AVB Camera / Automotive Ethernet Switch

Education

Master’s Degree
電機工程學系
2019 - 2021
Bachelor’s Degree
資訊工程學系
2015 - 2019