Lead IC frontend for Wafer Level Chip Scale Package and Through Silicon Via program operation management. • Leads foundries, assembly and test facilities related to new product development, product operations, product quality, delivery and procurement activities. • New product development execution. • New product introduction to mass production process control (stability) and best practice cross fertilization management • Drive post-production yield improvements and quality issue, lead continuous improvement programs to achieve outstanding yield and quality performance. • Lead supplier contingency planning and crisis management activities programs. • Supplier quarterly business review management and related activities execution. • Cooperate with planner, monitoring and execution of production capacity and scheduling. • Collaborate with procurement to lead and develop multi-year ODM procurement strategies based on business and market intelligence. Lead supplier procurement, selection and performance management. • Cooperate with quality control, customer complaint response and poor quality improvement implementation. • Successfully qualified new supplier in Mainland China – 20 percent of cost saving • Quick classification to solve a large number of chipping problems – scrap$saving 100M in 2021 • FTA tool analysis, effectively reducing the timeliness of CIS FA analysis – scrap$saving 300M in 2021

Directed the daily operations of one full-time engineer, Directed all aspects of reginal assembly house operation projects, from technical to high volume manufacturing for WLCSP/Ball Grid Array(BGA)/Lead frame (LF) •Leads assembly and test facilities related to new product development, product operations, product quality, delivery and procurement activities. • New product development execution. • New product introduction to mass production process control (stability) and best practice cross fertilization management • Drive post-production yield improvements and quality issue, lead continuous improvement programs to achieve outstanding yield and quality performance. • Lead supplier contingency planning and crisis management activities programs. • Supplier quarterly business review management and related activities execution. • Lead quality control, customer complaint response, regular audit and quality improvement implementation. • Use material knowledge to resolve line down issues • IATF/VDA solid training to solve EOS problems of automotive customers

Directed the daily operations of two full-time engineer, provides management for supplier chain technical and quality program management including the foundry, assembly, testing and module house of IC. Support manufacturing planning performance management. Ensures all sub-con processes are in accordance with company standards and all relevant regulations. Analyzed current processes before determining the most effective strategies which would ultimately result in cost reductions for the company while assessing yield enhancement and reliability stressing. • TV production line new product development execution, IC pad layout design. • TV production line relevant new product introduction to mass production process control (stability) and best practice cross fertilization management. • Cost saving for 50M US dollars by developing Cu wire to replace gold wire.

Directed the daily operations of six full-time employees while establishing long term goals. Facilitated the IC package and SMT process by surveying, selecting, and designing mechanical structures. Performed supplier chain management functions, including tasks involving assembly materials, Program management the BOM, NPI ramp up, quality resolving and customer complaint. • New product development execution, including BOM select. • New product introduction to mass production process control (stability) and best practice cross fertilization management. • Lead all IC assembly, SMT activities projects, including BGA/LGA/TSV/LF IC packaging. • Sent to Japan for half a year to learn Cu-pillar bump production and factory planning. •Assisted the company to build an 8" 12" Cu pillar bump production line, with a current monthly production capacity of 10K wafers.

Directed the daily operations of one full-time engineer, performed in-depth surveys of Driver IC assembly mechanical structures and materials before selecting the appropriate candidates to move forward with mass production. Spec. define and new program consultant with IC assembly, test and module house. Performed in-depth surveys and development of polymer particle for core-shell structure, which is particularly suitable for biomedical applications such as MRI (magnetic resonance imaging) developer, specific tissue identification developer, and magnetic thermal therapy. • New Technology Development of Electrode Bumps • Performed semiconductor polymer materials feasibility studies prior to selection • Awarded two Patent for metallization polymer particle for MRI applications. • Awarded with the ITRI Excellence Research for a NCF-type Compliant-bump COG in real display panel. • display panel ITRI transfers technology to related IC factory at 3M