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Motivated engineer who is highly energetic, outgoing and tenacity. Have project management experience. Ability to solve problems and rich cost down/capacity max out experience. Co-working with foreigners experience. Quickly learns and masters new concepts and skills.

“Percolation in Two-dimensional Nanoparticle Films from Colloidal Self-assembly” , 2007 , Physica Status Solidi (a) , vol.204 , p.1856-1862. (SCI期刊)

中原大學 Chung Yuan Christian University

Sr. Engineer

朱思明

Micron Technology 台灣美光

OCT CPEE CVD/PVD Sr. Engineer

Integrate supplier resources to reduce company cost and improve capacity.

台灣台中市

1.Published Micron internal paper in FY22.
2.TF line yield owner, and scrap wafer improve around 40%.
3.Contact Co/SICONI recipe optimization.
4.Digit line W sputter recipe development for RS reduction.
5.W/SIN capacity improve 5%~8% for max out project.


ADTT PVD Sr. Engineer

1.Development Ti/WN/WSI metal sputter recipe for digit line RS reduction
2.New tech process transfer form US RD team.


JTC Film Team Sr. Engineer

1.SPC champion, responsible for PVD team meet SPC KPI.
2.Responsible backend layers defect/cost/max out projects.
3.TSV Cu process transfer from JP RD team.


PEE PVD Sr. Engineer 

1.Published paper “Capacitance density and breakdown voltage improvement by optimizing the PECVD dielectric film characteristics in metal insulator metal capacitors” in IEEE symposium 2015
2.Responsible for Logic Foundry Thin Film process development



300台灣新竹市

Macronix International Co., LTD

TF Technology Development Engineer

1.. NOR/NAND-Flash memory yield and capacity improvement.
2. Thin Film PVD/CVD Process maintenance.
3. CIP competition received Honorable Mention.


朱思明’s posts