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TSMC PIE specializing in
advanced tech. semiconductor process (3nm~10nm). Well-versed in yield improvement of semiconductor manufacturing process, Logic IC yield
analysis, and collaborate with production line to solve problems . Made a huge leap for
TSMC advanced IC chip defect detection and yield improvement. Enthusiastic about
semiconductor product development and design which can change people's lives.

National Taiwan University

Yield Improvement Engineer

shih-heng sun

TSMC Fab12B

Process Integration Engineer

Proficient in analyzing the relationship between chip electrical properties and process problems. 
 		 Specialized in using electrical data analysis 3 nm - 5 nm to improve Logic IC performance 
 		 Experienced in hitherto the most advanced semiconductor process 3 nm .

Hsinchu, Hsinchu City, Taiwan

Expert in most advanced Logic IC process 5 nm - 10 nm and Familiar with advanced measuring instruments SEM, E-beam and Bright/Dark Field Inspection Tool 
 		 Specialized in detecting defects to improve yield 
 		 Collaborated with EE & PE to refine Logic IC manufacturing procedure and lower production cost.

shih-heng sun’s posts