I working as technical manager in Automotive Power Device Dept. at Actron. I have over 25 year IC & TO package assembly experience before join Actron. My major skill are including: project management, product development and process optimized. The advantage of my personal is well know how to quickly study sensitive parameter via DOE method and APQP procedure. Then let new product mass production soon. Recent year, I have limited experience for SiC , GaN and IGBT package and process development. The package types are including power package. Such as TO package and IPM. The process experience from SiC wafer saw to function test. I'm a right person to solve manufacturing details. Moreover, you may want to know how to qualified by automotive customer? I have several sucess experience that pass customer audit before mass production. I knew the key point that will not waste company's resource while new product developments .