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This package using Film Assistance Mold technology for optical device development. The result was collected in IMPACT yr 2007.

Yr 2006 IMPACT Presentation material

Optical QFN package in yr 2007

 I working as technical manager in Automotive Power Device Dept. at Actron. I have over 25 year IC & TO package assembly experience before join Actron. My major skill are including: project management, product development and process optimized. The advantage of my personal is well know how to quickly study sensitive parameter via DOE method and APQP procedure. Then let new product  mass production soon.
      Recent year, I have limited experience for SiC , GaN and IGBT package and process development. The package types are  including power package. Such as TO package and IPM. The process experience from SiC wafer saw to function test.  I'm a right person to solve manufacturing details.
      Moreover, you may want to know how to qualified by automotive customer? I have several  sucess experience that pass customer audit before mass production. I knew the key point that will not waste company's resource while new product developments .

Optical QFN package in yr 2007

Optical QFN package in yr 2007

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