Name: Cheng-En Lin 

Professional Summary: With 6 years of experience in packaging design, I specialize in multi-chip module, package on package, and embedded die package design . 

I have experience of communicating with clients and providing design solutions in a timely and efficient manner. 

Experience: Designed and managed multi-chip module, package on package, and embedded die package projects for the past 6 years Worked as a key communication window for clients within 6 months of starting at my previous company .

Assisted in the implementation of Calibre-related tasks, resulting in a 50% reduction in detection time Collaborated with IC design companies on verification module design, such as daisy chain design .

Wrote Calibre DRC programs to aid other companies in module design inspections and debugging 

Able to communicate with foreign clients and solve design problems .

Proficient in Cadence APD, Calibre verification programs, Klayout, AutoCAD, and Cam350 .

Possess strong teamwork skills, able to coordinate and collaborate across departments to complete tasks .

I am seeking a challenging position in the semiconductor industry where I can utilize my expertise and experience to contribute to the growth of the company.