Name: Cheng-En Lin
Professional Summary: With 6 years of experience in packaging design, I specialize in multi-chip module, package on package, and embedded die package design .
I have experience of communicating with clients and providing design solutions in a timely and efficient manner.
Experience: Designed and managed multi-chip module, package on package, and embedded die package projects for the past 6 years Worked as a key communication window for clients within 6 months of starting at my previous company .
Assisted in the implementation of Calibre-related tasks, resulting in a 50% reduction in detection time Collaborated with IC design companies on verification module design, such as daisy chain design .
Wrote Calibre DRC programs to aid other companies in module design inspections and debugging
Able to communicate with foreign clients and solve design problems .
Proficient in Cadence APD, Calibre verification programs, Klayout, AutoCAD, and Cam350 .
Possess strong teamwork skills, able to coordinate and collaborate across departments to complete tasks .
I am seeking a challenging position in the semiconductor industry where I can utilize my expertise and experience to contribute to the growth of the company.
2020/5 - Present
Mainly responsible for multi chip, package on package, embedded die interposer design.
Design review by CAM350 and Calibre, helps to do the modification and risk assessment.
Collaborating with customers to complete the interposer test vehicle with APD.
Design rules maintain .
Creating Calibre inspection program and maintaining.
Teaching customers how to use the layout to check the design connectivity.
2016/05 - 2020/01
Mainly responsible for wlcsp, flip chip product.
Based on customer die design, to create bumping, RDL, PSV, stencil mask and tape out.
Completely wafer design from a die, array to reticle and wafer.
Mask review by L-edit, modification and risk assessment.
Design rules maintain .
2011 - 2016
Name: Cheng-En Lin
Professional Summary: With 6 years of experience in packaging design, I specialize in multi-chip module, package on package, and embedded die package design .
I have experience of communicating with clients and providing design solutions in a timely and efficient manner.
Experience: Designed and managed multi-chip module, package on package, and embedded die package projects for the past 6 years Worked as a key communication window for clients within 6 months of starting at my previous company .
Assisted in the implementation of Calibre-related tasks, resulting in a 50% reduction in detection time Collaborated with IC design companies on verification module design, such as daisy chain design .
Wrote Calibre DRC programs to aid other companies in module design inspections and debugging
Able to communicate with foreign clients and solve design problems .
Proficient in Cadence APD, Calibre verification programs, Klayout, AutoCAD, and Cam350 .
Possess strong teamwork skills, able to coordinate and collaborate across departments to complete tasks .
I am seeking a challenging position in the semiconductor industry where I can utilize my expertise and experience to contribute to the growth of the company.
2020/5 - Present
Mainly responsible for multi chip, package on package, embedded die interposer design.
Design review by CAM350 and Calibre, helps to do the modification and risk assessment.
Collaborating with customers to complete the interposer test vehicle with APD.
Design rules maintain .
Creating Calibre inspection program and maintaining.
Teaching customers how to use the layout to check the design connectivity.
2016/05 - 2020/01
Mainly responsible for wlcsp, flip chip product.
Based on customer die design, to create bumping, RDL, PSV, stencil mask and tape out.
Completely wafer design from a die, array to reticle and wafer.
Mask review by L-edit, modification and risk assessment.
Design rules maintain .
2011 - 2016