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智慧製造全端開發工程師 @聯華電子股份有限公司
2022 ~ Present
AI工程師、機器學習工程師、深度學習工程師、影像演算法工程師、資料科學家、Ai Application Engineer,Machine Learning Engineer,Deep Learning Engineer,Data Scientist
Within one month
Python
Qt
Git
Employed
Ready to interview
Full-time / Interested in working remotely
4-6 years
元智大學 Yuan Ze University
工業工程與管理學系所
Avatar of 陳韋燁.
Avatar of 陳韋燁.
Past
工程師 @博彥科技有限公司
2018 ~ 2023
後端工程師
Within one month
陳韋燁 Taipei, [email protected] 具備豐富後端及韌體相關經驗 要求程式碼簡潔,以clean architecture為目標 熟稔底層原理,深度理解OOP 精通TDD,力求程式碼品質 樂於追求挑戰,精益求精 工作經歷 工程師 • 博彥科技有限公司 八月十二月 2023 | Taipei, Taiwan 智慧門鎖 家庭IOT,強化自家
C
C++
Golang
Unemployed
Ready to interview
Full-time / Interested in working remotely
4-6 years
龍華科技大學
資訊網路工程
Avatar of Jason Chou.
Avatar of Jason Chou.
SR. Vision System Engineer @開必拓數據
2019 ~ Present
資深視覺工程師 / 專案經理
Within one month
系統整合 產品規劃與開發 語言 中文- 母語 英文 - 中等 技術技能 Domain knowledge Computer vision algorithm application Electrical Control / Automatic Programing language: C# Python C++ javascript Frameworks ASP.NET Core Domain-Driven Design Microservice Clean Architecture WFP / WinForm React MVVM / MVC ROS2 Protocols RESTful API Modbus TCP / RTU MQTT gRPC Develop tools VS Code Visual Studio Arduino IDE Arduino PLC PlatfromIO Git Docker ssh moveit2 OS Windows Ubuntu Raspberry Pi OS Embedded system Arduino ESP32 Raspberry Pi, Pico
C#.NET development
c++ programming
python programming
Employed
Ready to interview
Full-time / Interested in working remotely
6-10 years
國立聯合大學 National United University
電子工程
Avatar of 李慕全(MuChuan Li).
Avatar of 李慕全(MuChuan Li).
Past
Service Provider @Taron Solutions Limited
2023 ~ 2023
AI工程師、機器學習工程師、電腦視覺工程師、資料科學家、Machine Learning Engineer、Computer Vision Engineer、Data Scientist
Within one month
裝裝置。 • 獲得創新創業教育計畫的 10 萬新台幣贊助。 • 參加 Acer 龍騰微笑智聯網在 800 多參賽隊伍中入選 12 強決賽。 技術: 物聯網、Raspberry Pi、Linux、Python、SolidWorks 專案開發經驗 智慧交通路側重辨識系統 實驗室產學合作案(資策會) 在台北市路口架設攝影機捕捉路況,透過
Machine Learning
Computer Vision
Pytorch/Tensorflow
Unemployed
Ready to interview
Full-time / Interested in working remotely
4-6 years
國立臺北科技大學
資訊工程
Avatar of Wang Chunshan.
Avatar of Wang Chunshan.
Data Engineer @TSMC 台積電
2022 ~ Present
資料分析師、演算法工程師、軟體工程師、軟體專案管理
Within one month
science debate robot using advanced language models and techniques.This robot simulates opposing viewpoints and provides users with adjustment suggestions at the end of the debate. We delved into technologies like RAG and Vector Search. And prompt engineering,utilizing PPO and PEFT for model fine-tuning. Engineer Intern, Jul– Sep. 2018, Yahoo! Developed Auto-labeling and ranking base on word-embedding for 6M items in Yahoo! shopping mall. IOT Software Developer Intern,–, Portwell, Inc. Built IoT farm demo server with Apache, MySQL, Xamarin, and Raspberry Pi. EDUCATION National Central ...
Backend Development
NLP
Python
Employed
Ready to interview
Full-time / Interested in working remotely
4-6 years
國立中央大學 National Central University
網路學習科技研究所
Avatar of 蕭舜誠-Shawn.
Avatar of 蕭舜誠-Shawn.
Firmware Engineer @Lanner Electronics Inc.
2021 ~ Present
Firmware Engineer, Firmware Developer, Embedded Software Engineer
Within one month
aforementioned firmware program were developed and research almost entirely by myself. I have solid grasp of FreeRTOS and gained practical experience in its implement. Firmware Engineer • Bovia AugustJuly 2021 | Taipei, Taiwan majorly dedicated to : MCU (ATtiny828 、Atmel-SAM4S Cortex-M4 、Arduino 、Teensy4.0) Linux System(Yocto、Ubuntu 、 Raspberry pi4) Linux Shell Script、C programming、Python3 Linux kernel (Yocto) Embedded system(Intel Edison) IoT System Sierra WP7502 wireless IoT module Peripherals Control & Design (Flir lepton thermal camera 、Auto Focus Zoom Module Camera 、5G modem 、HID ModuleEducation 國立高雄科技大學(原國立高
C
ARM
Linux
Employed
Ready to interview
Full-time / Interested in working remotely
4-6 years
國立高雄科技大學(原國立高雄第一科技大學)
電子工程
Avatar of the user.
Avatar of the user.
Past
Senior Firmware Engineer @Artesyn Embedded Technologies
2019 ~ 2022
韌體工程師/軟體工程師/控制工程師/演算法工程師/
Within one month
C
Python
C/C++
Unemployed
Ready to interview
Full-time / Interested in working remotely
6-10 years
日本電氣通信大學 The University of Electro-Communications (UEC)
Robotics Engineering
Avatar of 黃上溢.
Avatar of 黃上溢.
系統工程師 @筑波醫電
2016 ~ Present
資深軟體工程師
Within one month
樂於分享使自己和團隊更進步更有效率。 工作技能 Tech Stack C# C++ C dot-net UWP WinForm HTML5 BootStrap JavaScript PowerShell Design Tools Gitea SourceTree Visual Studio Notion Trello Teams Jenkins Visual Studio Code Raspberry Pi ProgreSQL SQL Server 作品集 https://www.cakeresume.com/me/oldyellow125/portfolios 工作經驗 2016/07 - Now 系統工程師(兼任PM) 筑波醫電 2016//10 系統工程
C#
UWP
Winform
Employed
Open to opportunities
Full-time / Interested in working remotely
10-15 years
交通大學
生醫工程暨資訊工程研究所
Avatar of Muflihun.
Avatar of Muflihun.
Senior Electrical Maintenance @Cogindo DayaBersama
2024 ~ Present
Electrical Engineering
Within one month
400V Induction Motors. Skilled in designing and repairing electronic PCB modules. Experienced in operating lifting and transportation equipment, especially forklift and crane. Certificate of Competence Senior Maintenance Executive of Thermal Power Plant (PLTU) Maintaining Generators and Coordinating Power Plant Maintenance - PT. TEU Senior Maintenance Technician of Thermal Power Plant (PLTU) Maintaining Generators and DC Power - PT. TEU Forklift Operator License Class 2 Trained Operator PCB Maker Level 2 - LSP Elektronika IOT Automation with Raspberry PI - Informit ITB Basic of Industrial Automation Using PLC - Informit ITB Language Indonesian English — Intermediate (Level B1) Spanish — Intermediate (Level B2)
Word
PowerPoint
Excel
Employed
Open to opportunities
Full-time / Interested in working remotely
4-6 years
Universitas Nusa Putra Sukabumi
Avatar of the user.
Avatar of the user.
Web Engineer @BlendVision
2023 ~ Present
Senior iOS Developer / Web Developer
Within one month
User Interface
Objective-C
Swift
Employed
Open to opportunities
Full-time / Interested in working remotely
4-6 years
National Ilan University
Bachelor degree

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Problem-Solving
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Adaptability
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Within one year
Test Solution Engineer @ Micron Technology 台灣美光
Logo of Micron Technology 台灣美光.
Micron Technology 台灣美光
2022 ~ Present
New Taipei City, Taiwan
Professional Background
Current status
Employed
Job Search Progress
Professions
Research / R&D
Fields of Employment
Mechanical or Industrial Engineering
Work experience
4-6 years work experience (6-10 years relevant)
Management
I've had experience in managing 5-10 people
Skills
System Identification
Composite Materials
Embedded System
Machine Vision
Control System
Electrical
Network
LabView
Arduino
PLC Programming
machine learning
computer vision
signal processing
PHP development
Wafer
Eager To Learn
Languages
Chinese
Fluent
English
Professional
Malay
Native or Bilingual
Job search preferences
Positions
Software Engineer, Research & Development, Project Manager
Job types
Full-time
Locations
Taiwan, 台灣
Remote
Interested in working remotely
Freelance
Yes, I freelance in my spare time
Educations
School
Universiti Malaysia Perlis
Major
Mechatronic Engineering
Print
Profile 03 00@2x

ANG JIA YI

Ang Jia Yi currently joins Micron Memory Taiwan as an advance packaging technology development department as silicon integration. He previously had years of experience in various programming language Eg: Modelling, C programming, Python, MATLAB Vision knowledge. He love robotic and have vase knowledge in embedded system

Mechatronic Engineer, Software Engineer, Project Manager, Data Engineer, Research & Development,
TW
[email protected]
Research Gate Page
My Curriculum Vitae


SKILL


C language, Assembly, Python, Basic Stamp, PLC, Matlab, PCB design, Robotics, Embedded system, 3D printing, Control system, Arduino, Microcontroller, LabView, Electronic and Electrical, System Identification, Artificial Neuron Network, Composite materials and piping, Machine Vision, Signal Processing, PHP .


Work Experience

Micron Technology 台灣美光, Test Solution Engineer, Mar 2022 ~ Present

-HBM2e & HBM3 3D Packaging Test Program Development
-Develop test program for HBM production automated test equipment including new test, product algorithms which covers software and hardware requirements.
-Evaluate and verify yield/quality to ensure the -Provide statistical data analysis, analytics and justification on program validation and its release

Micron Technology 台灣美光, APTD SILICON INTEGRATION ENGINEER, Feb 2021 ~ Mar 2022

 HBM2e & HBM3 3D Packaging Research Program and Development
 Analyze and improve BEOL layout and chip package interaction (CPI) failure
 Prepare test environment for new test chip by determine the spec limit and monitor yield.
 Prepare details information for team member by document layout and CPI information.
 Provide layout related support to process team on determine failure

Braintech Sdn Bhd, Project Manager, Jun 2019 ~ Jul 2020

 Manage and maintain brain computer interface the product/software development
 Meet customer timeline and expectation by managing the project flow
 Increase the brain signal channel from 2 to 6 channel by restructure hardware and software
 Interpret brain signal using ANN modelling for hardware application
 Represent company in various talk, expedition, and competition local or oversea

X-CProblem, R&D Engineer, Apr 2014 ~ Oct 2018

Fulfill customer need by dealing with both hardware and software development
 Design a python based raspberry pi MCU tutorial module for lecturer
 Develop a mini demo waves electric generator
 Develop and design a SPA system by preparing the embedded system, custom protocol and PCB circuits to communicate with smartphone device using Bluetooth
 Redesign a hotel door lock system by giving support on the protocol restructure to support IoT system to link with smartphone

Cytron Technology Sdn Bhd, Internship Test Engineer, Jun 2012 ~ Aug 2012

 Design MCU PIC16/18 training kit by prepare coding tutorial and training documentation
 Decode PS2 keyboard/mouse protocol as controller input by prepare sample code/circuit
 Preparing NFC-MCU application by understanding protocol and preparing tutorial
 Design high power motor robot and control using RF signal

EDUCATION

Doctor of Philosophy (Ph.D.) in Mechatronic Engineering, School of Mechatronic Engineering, University Malaysia Perlis, Perlis, Malaysia  2013/10 – 2018/10


Bachelor of Engineering (Hons) in Mechatronic Engineering, School of Mechatronic Engineering, University Malaysia Perlis, Perlis, Malaysia 2009/6 – 2013/10

Professional Certification

Graduate Engineer, Board of Engineer Malaysia (BEM), 102258A (Mechatronic)

Certified LabVIEW Associate Developer (CLAD), 100-312-1821 (National Instruments)

Publication

Universiti Malaysia Perlis, Doctor of Philosophy (PhD), Mechatronic Engineering, 2013 ~ 2018


Thesis title: “Design and Development of Artificial Neural Network Model for Liquid Pressurized System Based on Glass Fibre Reinforced Epoxy (GRE) Composite Pipe”

With the rapid growth of science and technology, glass fibre reinforced epoxy (GRE) composite pipe has become part of the vital engineering elements in the engineering field. Therefore, qualification program plays an important role to ensure that the performance of the GRE pipe has achieved a reliable standard with excellent quality. Conventional test procedure which refers to ISO 14692 qualification test based on the regression analysis requires typically extensive amounts of time and cost to identify the performance of the new composite pipe. With the aid of mathematical modelling, the performance of the composite pipe can be predicted where this can reduce errors when designing the pipe. This research aims to model the performance of the GRE composite pipes and thus, identify the pipe’s first ply failure (FPF). First of all, an artificial neural network (ANN) model was developed to predict the onset of failure of GRE composite pipes. The ANN model was developed using input data namely, modulus of elasticity (axial), modulus of elasticity (hoop), volume fraction, diameter, thickness, pipe winding angle, stress ratio and pressure and the output data from the first-ply failure indicator of experimental data from previous research. The data obtained then underwent the smoothing and classification process to improve the accuracy of the model developed. In the smoothing process, the data was filtered using a smoothing algorithm to remove the unnecessary noise data followed by the classification process which categorised, recognised and differentiated the data from the known population. After the pre-processing, the data was used for the model training process. In the process, neural network training parameters needed to be decided. The parameter decided the number of neurons and the number of layers. In the model development, the mean accuracy of the model was calculated based on ten trials. By analysis and various trials, the highest accuracy model obtained would be used to predict the first-ply failure of the GRE composite pipe. A portable automated pressure test rig was also developed based on the monotonic/cyclic test protocol similar to the procedure elucidated in ASTM D2992 standard. The test rig served as a platform to obtain the experimental data for another model verification procedures. The validation process, on the other hand, was conducted to strengthen the reliability of the ANN model obtained. The validation process of the model was conducted using some other finding which was not included in the training process data. Therefore, the developed model was expected to predict the first-ply failure within the pipe composite laminated under various biaxial stress ratios. From the result, the three-layer ANN model structure was chosen where the means accuracy achieved was within 95%-99.66%. From the model verification process, the pure hydrostatic experimental comparison and the five different stress ratios test for ±55° GRE pipe accuracy was in the range of 77%-97%. For the validation test with experimental findings, a good agreement with the model’s predictions was achieved, with less than 30% variation. From the results, it has suggested that the ANN model can be extended to yield useful predictions of the onset of failure in composite pipes under a range of stress conditions. This can be utilised as an internal means for pipe rating prior to the required standard of the ASTM qualification process.

Universiti Malaysia Perlis, Bachelor of Engineering (Hons)(BEng), Mechatronic Engineering, 2008 ~ 2013


Final Year Project title: “Modeling and Control of Flexible structure for a Satellite Using Active and Passive Damper


Vibration normally will be a problem for satellite since there are disturbance occurred when maneuvering the satellite due to satellite reaction wheel and the solar wind. Therefore studying on vibration is one of the important issues to solve the problem of the vibration. Modeling for the flexible structure for the satellite which causes vibration would be proposed. The appendages of the satellite will only be represented by using a cantilever. Only an appendage will be considered for the sake of analysis. The mathematical equation of the cantilever and its model will be developed and designed in order to make research on it. The combination of embedded system and control system will be applied for analysis and to verify and developed model. Passive damper is introduced in this project to reduce the vibration. Also an active damper will be tested for further reducing the vibration. The development of the flexible model had been verified through cantilever experiment. Passive damper has been used to reduce the vibration and further improvement has been achieved further using an active damper.

Project 1

Projects 00 00@2x

Design and Development of Artificial Neural Network Model for Liquid Pressurized System Based on Glass Fibre Reinforced Epoxy (GRE) Composite Pipe

(Q1, IF: 3.858)

Patent Application No. : PI 2015 700298

Industry Design Application No. : 15-E0048-0101

了解詳情

Project 2

Projects 00 00@2x

Microcontroller-based for system identification tools using least square method for RC circuits

SCOPUS Indexed

了解詳情
Projects 02 00@2x

Intelligent Railway Control & Track Switching

The project is to design an intelligent railway gate control and tracking switching.The project is also programmed using PIC18F4580 using C language. All the information will be sent wirelessly through X-Bee to the PC.

Robotic Arms

Design and develop a robotic arm from hardware design, electric circuit and programming.

Paragraph image 00 00@2x

PCB Inspection Using Machine Vision

This project is design of smart machine vision (SMV) system to identified the damage of circuit board (PCB). This project is only completed using Matlab software which is one of the powerful mathematical toolbox program.

Paragraph image 02 00@2x

Mind Control Race Car

Mind Control VR for gaming


both using mindata chip.


Paragraph image 04 00@2x
Paragraph image 04 01@2x

QRCODE SCANNER

RASPBERRY PI + OPENCV

Wireless Power Transmission


Paragraph image 06 00@2x
Paragraph image 06 01@2x
Paragraph image 06 02@2x

Resume
Profile
Profile 03 00@2x

ANG JIA YI

Ang Jia Yi currently joins Micron Memory Taiwan as an advance packaging technology development department as silicon integration. He previously had years of experience in various programming language Eg: Modelling, C programming, Python, MATLAB Vision knowledge. He love robotic and have vase knowledge in embedded system

Mechatronic Engineer, Software Engineer, Project Manager, Data Engineer, Research & Development,
TW
[email protected]
Research Gate Page
My Curriculum Vitae


SKILL


C language, Assembly, Python, Basic Stamp, PLC, Matlab, PCB design, Robotics, Embedded system, 3D printing, Control system, Arduino, Microcontroller, LabView, Electronic and Electrical, System Identification, Artificial Neuron Network, Composite materials and piping, Machine Vision, Signal Processing, PHP .


Work Experience

Micron Technology 台灣美光, Test Solution Engineer, Mar 2022 ~ Present

-HBM2e & HBM3 3D Packaging Test Program Development
-Develop test program for HBM production automated test equipment including new test, product algorithms which covers software and hardware requirements.
-Evaluate and verify yield/quality to ensure the -Provide statistical data analysis, analytics and justification on program validation and its release

Micron Technology 台灣美光, APTD SILICON INTEGRATION ENGINEER, Feb 2021 ~ Mar 2022

 HBM2e & HBM3 3D Packaging Research Program and Development
 Analyze and improve BEOL layout and chip package interaction (CPI) failure
 Prepare test environment for new test chip by determine the spec limit and monitor yield.
 Prepare details information for team member by document layout and CPI information.
 Provide layout related support to process team on determine failure

Braintech Sdn Bhd, Project Manager, Jun 2019 ~ Jul 2020

 Manage and maintain brain computer interface the product/software development
 Meet customer timeline and expectation by managing the project flow
 Increase the brain signal channel from 2 to 6 channel by restructure hardware and software
 Interpret brain signal using ANN modelling for hardware application
 Represent company in various talk, expedition, and competition local or oversea

X-CProblem, R&D Engineer, Apr 2014 ~ Oct 2018

Fulfill customer need by dealing with both hardware and software development
 Design a python based raspberry pi MCU tutorial module for lecturer
 Develop a mini demo waves electric generator
 Develop and design a SPA system by preparing the embedded system, custom protocol and PCB circuits to communicate with smartphone device using Bluetooth
 Redesign a hotel door lock system by giving support on the protocol restructure to support IoT system to link with smartphone

Cytron Technology Sdn Bhd, Internship Test Engineer, Jun 2012 ~ Aug 2012

 Design MCU PIC16/18 training kit by prepare coding tutorial and training documentation
 Decode PS2 keyboard/mouse protocol as controller input by prepare sample code/circuit
 Preparing NFC-MCU application by understanding protocol and preparing tutorial
 Design high power motor robot and control using RF signal

EDUCATION

Doctor of Philosophy (Ph.D.) in Mechatronic Engineering, School of Mechatronic Engineering, University Malaysia Perlis, Perlis, Malaysia  2013/10 – 2018/10


Bachelor of Engineering (Hons) in Mechatronic Engineering, School of Mechatronic Engineering, University Malaysia Perlis, Perlis, Malaysia 2009/6 – 2013/10

Professional Certification

Graduate Engineer, Board of Engineer Malaysia (BEM), 102258A (Mechatronic)

Certified LabVIEW Associate Developer (CLAD), 100-312-1821 (National Instruments)

Publication

Universiti Malaysia Perlis, Doctor of Philosophy (PhD), Mechatronic Engineering, 2013 ~ 2018


Thesis title: “Design and Development of Artificial Neural Network Model for Liquid Pressurized System Based on Glass Fibre Reinforced Epoxy (GRE) Composite Pipe”

With the rapid growth of science and technology, glass fibre reinforced epoxy (GRE) composite pipe has become part of the vital engineering elements in the engineering field. Therefore, qualification program plays an important role to ensure that the performance of the GRE pipe has achieved a reliable standard with excellent quality. Conventional test procedure which refers to ISO 14692 qualification test based on the regression analysis requires typically extensive amounts of time and cost to identify the performance of the new composite pipe. With the aid of mathematical modelling, the performance of the composite pipe can be predicted where this can reduce errors when designing the pipe. This research aims to model the performance of the GRE composite pipes and thus, identify the pipe’s first ply failure (FPF). First of all, an artificial neural network (ANN) model was developed to predict the onset of failure of GRE composite pipes. The ANN model was developed using input data namely, modulus of elasticity (axial), modulus of elasticity (hoop), volume fraction, diameter, thickness, pipe winding angle, stress ratio and pressure and the output data from the first-ply failure indicator of experimental data from previous research. The data obtained then underwent the smoothing and classification process to improve the accuracy of the model developed. In the smoothing process, the data was filtered using a smoothing algorithm to remove the unnecessary noise data followed by the classification process which categorised, recognised and differentiated the data from the known population. After the pre-processing, the data was used for the model training process. In the process, neural network training parameters needed to be decided. The parameter decided the number of neurons and the number of layers. In the model development, the mean accuracy of the model was calculated based on ten trials. By analysis and various trials, the highest accuracy model obtained would be used to predict the first-ply failure of the GRE composite pipe. A portable automated pressure test rig was also developed based on the monotonic/cyclic test protocol similar to the procedure elucidated in ASTM D2992 standard. The test rig served as a platform to obtain the experimental data for another model verification procedures. The validation process, on the other hand, was conducted to strengthen the reliability of the ANN model obtained. The validation process of the model was conducted using some other finding which was not included in the training process data. Therefore, the developed model was expected to predict the first-ply failure within the pipe composite laminated under various biaxial stress ratios. From the result, the three-layer ANN model structure was chosen where the means accuracy achieved was within 95%-99.66%. From the model verification process, the pure hydrostatic experimental comparison and the five different stress ratios test for ±55° GRE pipe accuracy was in the range of 77%-97%. For the validation test with experimental findings, a good agreement with the model’s predictions was achieved, with less than 30% variation. From the results, it has suggested that the ANN model can be extended to yield useful predictions of the onset of failure in composite pipes under a range of stress conditions. This can be utilised as an internal means for pipe rating prior to the required standard of the ASTM qualification process.

Universiti Malaysia Perlis, Bachelor of Engineering (Hons)(BEng), Mechatronic Engineering, 2008 ~ 2013


Final Year Project title: “Modeling and Control of Flexible structure for a Satellite Using Active and Passive Damper


Vibration normally will be a problem for satellite since there are disturbance occurred when maneuvering the satellite due to satellite reaction wheel and the solar wind. Therefore studying on vibration is one of the important issues to solve the problem of the vibration. Modeling for the flexible structure for the satellite which causes vibration would be proposed. The appendages of the satellite will only be represented by using a cantilever. Only an appendage will be considered for the sake of analysis. The mathematical equation of the cantilever and its model will be developed and designed in order to make research on it. The combination of embedded system and control system will be applied for analysis and to verify and developed model. Passive damper is introduced in this project to reduce the vibration. Also an active damper will be tested for further reducing the vibration. The development of the flexible model had been verified through cantilever experiment. Passive damper has been used to reduce the vibration and further improvement has been achieved further using an active damper.

Project 1

Projects 00 00@2x

Design and Development of Artificial Neural Network Model for Liquid Pressurized System Based on Glass Fibre Reinforced Epoxy (GRE) Composite Pipe

(Q1, IF: 3.858)

Patent Application No. : PI 2015 700298

Industry Design Application No. : 15-E0048-0101

了解詳情

Project 2

Projects 00 00@2x

Microcontroller-based for system identification tools using least square method for RC circuits

SCOPUS Indexed

了解詳情
Projects 02 00@2x

Intelligent Railway Control & Track Switching

The project is to design an intelligent railway gate control and tracking switching.The project is also programmed using PIC18F4580 using C language. All the information will be sent wirelessly through X-Bee to the PC.

Robotic Arms

Design and develop a robotic arm from hardware design, electric circuit and programming.

Paragraph image 00 00@2x

PCB Inspection Using Machine Vision

This project is design of smart machine vision (SMV) system to identified the damage of circuit board (PCB). This project is only completed using Matlab software which is one of the powerful mathematical toolbox program.

Paragraph image 02 00@2x

Mind Control Race Car

Mind Control VR for gaming


both using mindata chip.


Paragraph image 04 00@2x
Paragraph image 04 01@2x

QRCODE SCANNER

RASPBERRY PI + OPENCV

Wireless Power Transmission


Paragraph image 06 00@2x
Paragraph image 06 01@2x
Paragraph image 06 02@2x